Felix Kaess

Correlation between mobility collapse and carbon impurities in Si-doped GaN grown by low pressure metalorganic chemical vapor deposition

In the low doping range below 1 × 1017 cm−3, carbon was identified as the main defect attributing to the sudden reduction of the electron mobility, the electron mobility collapse, in n-type GaN grown by low pressure metalorganic chemical vapor deposition. Secondary ion mass spectroscopy has been performed in conjunction with C concentration and the thermodynamic Ga supersaturation model. By controlling the ammonia flow rate, the input partial pressure of Ga precursor, and the diluent gas within the Ga supersaturation model, the C concentration in Si-doped GaN was controllable from 6 × 1019 cm−3 to values as low as 2 × 1015 cm−3. It was found that the electron mobility collapsed as a function of free carrier concentration, once the Si concentration closely approached the C concentration. Lowering the C concentration to the order of 1015 cm−3 by optimizing Ga supersaturation achieved controllable free carrier concentrations down to 5 × 1015 cm−3 with a peak electron mobility of 820 cm2/V s without observing...

Defect-free Ni/GaN Schottky barrier behavior with high temperature stability

In this work, we report on defect-free homogeneous behavior of Ni Schottky contacts patterned on surface treated n-GaN by photolithography with unity ideality factor, high temperature stability, and low reverse leakage. The barrier height (0.7 eV) and ideality factor (1.02) are found to be independent of temperature, indicating a highly homogeneous contact. The contacts are found to be stable with no significant change in ideality factor or leakage current up to an annealing temperature of 600 °C. Temperature dependence of the reverse leakage current shows no evidence for the existence of surface defects that would provide leakage paths, and the behavior was modeled by ATLAS simulations with an ideal homogeneous barrier of 0.7 eV. Consequently, the forward and reverse bias characteristics are explained by a common set of parameters. The surface treatment after the development and prior to metallization included an acid-based surface treatment. X-ray photoelectron spectroscopy (XPS) studies indicate that t...

Fabrication and structural properties of AlN submicron periodic lateral polar structures and waveguides for UV-C applications

Periodically poled AlN thin films with submicron domain widths were fabricated for nonlinear applications in the UV-VIS region. A procedure utilizing metalorganic chemical vapor deposition growth of AlN in combination with laser interference lithography was developed for making a nanoscale lateral polarity structure (LPS) with domain size down to 600 nm. The Al-polar and N-polar domains were identified by wet etching the periodic LPS in a potassium hydroxide solution and subsequent scanning electron microscopy (SEM) characterization. Fully coalesced and well-defined vertical interfaces between the adjacent domains were established by cross-sectional SEM. AlN LPSs were mechanically polished and surface roughness with a root mean square value of ∼10 nm over a 90 μm × 90 μm area was achieved. 3.8 μm wide and 650 nm thick AlN LPS waveguides were fabricated. The achieved domain sizes, surface roughness, and waveguides are suitable for second harmonic generation in the UVC spectrum.

Point defect reduction in wide bandgap semiconductors by defect quasi Fermi level control

A theoretical framework for a general approach to reduce point defect density in materials via control of defect quasi Fermi level (dQFL) is presented. The control of dQFL is achieved via excess minority carrier generation. General guidelines for controlling dQFL that lead to a significant reduction in compensating point defects in any doped material is proposed. The framework introduces and incorporates the effects of various factors that control the efficacy of the defect reduction process such as defect level, defect formation energy, bandgap, and excess minority carrier density. Modified formation energy diagrams are proposed, which illustrate the effect of the quasi Fermi level control on the defect formation energies. These formation energy diagrams provide powerful tools to determine the feasibility and requirements to produce the desired reduction in specified point defects. An experimental study of the effect of excess minority carriers on point defect incorporation in GaN and AlGaN shows an exce...

The effect of illumination power density on carbon defect configuration in silicon doped GaN

A study of efficacy of point defect reduction via Fermi level control during growth of GaN:Si as a function of above bandgap illumination power density and hence excess minority carrier density is presented. Electrical characterization revealed an almost two-fold increase in carrier concentration and a three-fold increase in mobility by increasing the illumination power density from 0 to 1 W cm−2, corroborating a decrease in compensation and ionic impurity scattering. The effect was further supported by the photoluminescence studies, which showed a monotonic decrease in yellow luminescence (attributed to CN) as a function of illumination power density. Secondary ion mass spectroscopy studies showed no effect of illumination on the total incorporation of Si or C. Thus, it is concluded that Fermi level management changed the configuration of the C impurity as the CN−1 configuration became energetically less favorable due to excess minority carriers.

Strain engineered high reflectivity DBRs in the deep UV

The maximum achievable reflectivity of current III-nitride Bragg reflectors in the UV-C spectral range is limited due to plastic relaxation of thick multilayer structures. Cracking due to a large mismatch of the thermal expansion and lattice constants between AlxGa1-xN/AlyGa1-yN alloys of different composition and the substrate at the heterointerface is the common failure mode. Strain engineering and strain relaxation concepts by the growth on a strain reduced Al0.85Ga0.15N template and the implementation of low temperature interlayers is demonstrated. A significant enhancement of the maximum reflectivity above 97% at a resonance wavelength of 270 nm due to an increase of the critical thickness of our AlN/Al0.65Ga0.35N DBRs to 1.45 μm (25.5 pairs) prove their potential. By comparing the growth of identical Bragg reflectors on different pseudo-templates, the accumulated mismatch strain energy in the DBR, not the dislocation density provided by the template/substrate, was identified to limit the critical thickness. To further enhance the reflectivity low temperature interlays were implemented into the DBR to partially relief the misfit strain. Relaxation is enabled by the nucleation of small surface domains facilitating misfit dislocation injection and glide. Detailed structural and optical investigations will be conducted to prove the influence of the LT-AlN interlayers on the strain state, structural integrity and reflectivity properties. Coherent growth and no structural and optical degradation of the Bragg mirror properties was observed proving the fully applicability of the relaxation concept to fabricate thick high reflectivity DBR and vertical cavity laser structures.

High reflectivity III-nitride UV-C distributed Bragg reflectors for vertical cavity emitting lasers

UV-C distributed Bragg reflectors (DBRs) for vertical cavity surface emitting laser applications and polariton lasers are presented. The structural integrity of up to 25 layer pairs of AlN/Al0.65Ga0.35N DBRs is maintained by balancing the tensile and compressive strain present between the single layers of the multilayer stack grown on top of an Al0.85Ga0.35N template. By comparing the structural and optical properties for DBRs grown on low dislocation density AlN and AlGaN templates, the criteria for plastic relaxation by cracking thick nitride Bragg reflectors are deduced. The critical thickness is found to be limited mainly by the accumulated strain energy during the DBR growth and is only negligibly affected by the dislocations. A reflectance of 97.7% at 273 nm is demonstrated. The demonstrated optical quality and an ability to tune the resonance wavelength of our resonators and microcavity structures open new opportunities for UV-C vertical emitters.

Defect quasi Fermi level control-based CN reduction in GaN: Evidence for the role of minority carriers

Compensating point defect reduction in wide bandgap semiconductors is possible by above bandgap illumination based defect quasi Fermi level (dQFL) control. The point defect control technique employs excess minority carriers that influence the dQFL of the compensator, increase the corresponding defect formation energy, and consequently are responsible for point defect reduction. Previous studies on various defects in GaN and AlGaN have shown good agreement with the theoretical model, but no direct evidence for the role of minority carriers was provided. In this work, we provide direct evidence for the role of minority carriers in reducing point defects by studying the predicted increase in work done against defect (CN−1) formation with the decrease in the Fermi level (free carrier concentration) in Si doped GaN at a constant illumination intensity. Comparative defect photoluminescence measurements on illuminated and dark regions of GaN show an excellent quantitative agreement with the theory by exhibiting ...

High temperature and low pressure chemical vapor deposition of silicon nitride on AlGaN: Band offsets and passivation studies

In this work, we employed X-ray photoelectron spectroscopy to determine the band offsets and interface Fermi level at the heterojunction formed by stoichiometric silicon nitride deposited on AlxGa1-xN (of varying Al composition “x”) via low pressure chemical vapor deposition. Silicon nitride is found to form a type II staggered band alignment with AlGaN for all Al compositions (0 ≤ x ≤ 1) and present an electron barrier into AlGaN even at higher Al compositions, where Eg(AlGaN) > Eg(Si3N4). Further, no band bending is observed in AlGaN for x ≤ 0.6 and a reduced band bending (by ∼1 eV in comparison to that at free surface) is observed for x > 0.6. The Fermi level in silicon nitride is found to be at 3 eV with respect to its valence band, which is likely due to silicon (≡Si0/−1) dangling bonds. The presence of band bending for x > 0.6 is seen as a likely consequence of Fermi level alignment at Si3N4/AlGaN hetero-interface and not due to interface states. Photoelectron spectroscopy results are corroborated by current-voltage-temperature and capacitance-voltage measurements. A shift in the interface Fermi level (before band bending at equilibrium) from the conduction band in Si3N4/n-GaN to the valence band in Si3N4/p-GaN is observed, which strongly indicates a reduction in mid-gap interface states. Hence, stoichiometric silicon nitride is found to be a feasible passivation and dielectric insulation material for AlGaN at any composition.

Point defect reduction in MOCVD (Al)GaN by chemical potential control and a comprehensive model of C incorporation in GaN

A theoretical framework that provides a quantitative relationship between point defect formation energies and growth process parameters is presented. It enables systematic point defect reduction by chemical potential control in metalorganic chemical vapor deposition (MOCVD) of III-nitrides. Experimental corroboration is provided by a case study of C incorporation in GaN. The theoretical model is shown to be successful in providing quantitative predictions of CN defect incorporation in GaN as a function of growth parameters and provides valuable insights into boundary phases and other impurity chemical reactions. The metal supersaturation is found to be the primary factor in determining the chemical potential of III/N and consequently incorporation or formation of point defects which involves exchange of III or N atoms with the reservoir. The framework is general and may be extended to other defect systems in (Al)GaN. The utility of equilibrium formalism typically employed in density functional theory in p...