Frank Jakubowski

Methods of forming bulk finfet devices so as to reduce punch through leakage currents

Semiconductor Device Comprising Self-Aligned Contact Elements and a Replacement Gate Electrode Structure

Semiconductor device comprising self-aligned contact elements

High performance HKMG stack for gate first integration

Method of Removing Gate Cap Materials While Protecting Active Area

WAFER EDGE PROTECTION

STI SILICON NITRIDE CAP FOR FLAT FEOL TOPOLOGY

METHODS OF FORMING ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES BY PERFORMING A DRY CHEMICAL REMOVAL PROCESS

Halbleiterbauelement mit selbstjustierten Kontaktelementen und einer Austauschgateelektrodenstruktur

SOI Semiconductor Device Comprising a Substrate Diode with Reduced Metal Silicide Leakage