Frank Rudolf

Nanostructured Alumina Coatings for Room Temperature Processability of Au Bonding Wires

Wire bonding is the most common technology to connect bare dies on hybrids. For such applications, e.g. automotive applications or sensor modules, highly reliable Au/Au interconnections are preferred. But the standard ball/wedge bond process for Au-wires requires temperatures over 120degC, which is a serious disadvantage when connecting temperature sensitive devices. One of the most promising solution to overcome this problem is alumina coated Au bonding wires. In the present work we have studied the characterisation and optimisation of coated gold wires for ultrasonic wedge/wedge bonding, including the optimisation of wire bond process parameters, reliability testing and material characterisation of the metallurgical state of the wire bonds

Influence of Medical Sterilization on Material Systems of Electronics

Medical micro devices should be sterilized by one of the not so harmful processes before they are in use. Each process will be affecting the parameters of the packaging and electronic materials. This paper describes the results of experiments of gold and aluminium wires for bonding electrical contacts as well as flip-chip-contacts on RFID under the influence of sterilization by moist heat according DIN EN 554. The experiments of pull- and shear measurements give the results that contacts with gold wires will be suitable in most cases and the contacts consisting of aluminium wires break down. Flip-chip-contacts are working after more than 25 sterilization procedures again