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Fumio Miyagawa

Fujitsu

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Publication

Featured researches published by Fumio Miyagawa.

Archive | 1988

Package for mounting a semiconductor chip of ultra-high frequency

Fumio Miyagawa; Hiroyuki Sakai; Toshikazu Takenouchi

Archive | 1994

Coaxial line assembly of a package for a high frequency element

Takaharu Miyamoto; Fumio Miyagawa; Yoji Ohashi; Tamio Saito

Archive | 1989

Package for superconducting devices

Seigo Kotani; Hiroyuki Sakai; Toshikazu Takenouchi; Fumio Miyagawa

Archive | 1995

Bga package and mounting structure thereof

Fumio Miyagawa; Shigeo Nakajima; 茂生 中島; 文雄 宮川

Archive | 1989

Package for electronic devices operating at different respective temperatures

Seigo Kotani; Hiroyuki Sakai; Toshikazu Takenouchi; Fumio Miyagawa

Archive | 1997

Packaging structure to substrate of semiconductor chip

Fumio Miyagawa; 文雄 宮川

Archive | 1992

Process for making a package for accommodating electronic elements

Takaharu Miyamoto; Fumio Miyagawa; Tsutomu Higuchi

Archive | 1992

METHOD OF FORMING METAL SIDE WALL OF ELECTRONIC PART PACKAGE

Tsutomu Higuchi; Fumio Miyagawa; Takaharu Miyamoto; 文雄 宮川; 隆春 宮本; 努 樋口

Archive | 1992

Process for making a metal wall of a package used for accommodating electronic elements

Takaharu Miyamoto; Fumio Miyagawa; Tsutomu Higuchi

Archive | 1998

Semiconductor chip or mounting structure of semiconductor device on mounted substrate

Fumio Miyagawa; 文雄 宮川

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Collaboration

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Takaharu Miyamoto

Fujitsu

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Toshikazu Takenouchi

Fujitsu

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Hiroyuki Sakai

Fujitsu

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Seigo Kotani

Fujitsu

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Tamio Saito

Fujitsu

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Yoji Ohashi

Fujitsu

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Atsuki Inoue

Fujitsu

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Hideo Suzuki

Hamamatsu Photonics

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Shigeru Yoshida

University of Tokyo

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Shinya Hasuo

Fujitsu

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