G. Alastair Armstrong

Performance assessment of nanoscale double- and triple- gate FinFETs

Based on 3D simulations, we report a performance assessment of triple- and double-gate FinFETs for high performance (HP), low operating power (LOP) and low standby power (LSTP) logic technologies according to ITRS 65 nm node specifications. The impact of spacer width, lateral source/drain doping gradient, aspect ratio, fin thickness and height along with gate work function on the device performance has been analysed in detail and guidelines are presented to meet the ITRS projections. The design guidelines proposed for a 65 nm node are also examined for a 45 nm node for triple- and double-gate FinFETs. Results show that lateral source/drain doping gradient along with spacer width can not only effectively control short channel effects, thus presenting low off-current, but can also be optimized to achieve low values of intrinsic delay. FinFETs should be designed with a higher aspect ratio (~4) along with lower values of fin thickness to achieve ITRS targets for off-current and intrinsic delay. Triple-gate FinFETs show greater design flexibility in selecting important technological and device parameters as compared to double-gate devices. A design window is presented to achieve ITRS targets for the three logic technology requirements with triple- and double-gate FinFETs.

Comparative analysis of nanoscale MOS device architectures for RF applications

The suitability of nanoscale non-planar FinFETs and classical planar single and double gate SOI MOSFETs for rf applications is examined via extensive 3D device simulations and detailed interpretation. It is shown that although nanoscale FinFETs achieve higher values of intrinsic dc gain (nearly 20 dB higher than planar SG devices), they also present higher gate capacitance that severely undermines their rf performance. We also show that at large values of drain currents, well-designed conventional planar single and double gate SOI MOSFETs attain higher values of cut-off frequency compared to FinFETs, whereas at lower drain currents, a well-aligned planar double gate SOI MOSFET is the optimal structure. The reason for higher parasitic capacitance in FinFETs as compared to planar MOSFETs is examined in detail. An assessment of the impact of back gate misalignment on the rf performance of a 25 nm gate length planar double gate MOSFET indicates that a misalignment of 12 nm towards the source end is acceptable to give superior performance to a FinFET. The importance of source/drain extension region engineering in nanoscale FinFETs for ultra-low voltage analogue applications is also investigated. RF figures of merit for planar and vertical MOS devices are also compared based on layout-area calculations. The paper provides valuable design insights for optimizing device parameters for nanoscale planar and vertical MOSFETs.

Comparative analysis of the DC performance of DG MOSFETs on highly-doped and near-intrinsic silicon layers

Abstract A comparison of dc characteristics of fully depleted double-gate (DG) MOSFETs with respect to low-power circuit applications and device scaling has been performed by two-dimensional device simulation. Three different DG MOSFET structures including a conventional N + polysilicon gate device with highly doped Si layer, an asymmetrical P + /N + polysilicon gate device with low doped Si layer and a mid-gap metal gate device with low doped Si layer have been analysed. It was found that DG MOSFET with mid-gap metal gates yields the best dc parameters for given off-state drain leakage current and highest immunity to the variation of technology parameters (gate length, gate oxide thickness and Si layer thickness). It is also found that an asymmetrical P + /N + polysilicon gate DG MOSFET design offers comparable dc characteristics, but better parameter immunity to technology tolerances than a conventional DG MOSFET.

Performance projections and design optimization of planar double gate SOI MOSFETs for logic technology applications

In this paper, by investigating the influence of source/drain extension region engineering (also known as gate?source/drain underlap) in nanoscale planar double gate (DG) SOI MOSFETs, we offer new insights into the design of future nanoscale gate-underlap DG devices to achieve ITRS projections for high performance (HP), low standby power (LSTP) and low operating power (LOP) logic technologies. The impact of high-? gate dielectric, silicon film thickness, together with parameters associated with the lateral source/drain doping profile, is investigated in detail. The results show that spacer width along with lateral straggle can not only effectively control short-channel effects, thus presenting low off-current in a gate underlap device, but can also be optimized to achieve lower intrinsic delay and higher on?off current ratio (Ion/Ioff). Based on the investigation of on-current (Ion), off-current (Ioff), Ion/Ioff, intrinsic delay (?), energy delay product and static power dissipation, we present design guidelines to select key device parameters to achieve ITRS projections. Using nominal gate lengths for different technologies, as recommended from ITRS specification, optimally designed gate-underlap DG MOSFETs with a spacer-to-straggle (s/?) ratio of 2.3 for HP/LOP and 3.2 for LSTP logic technologies will meet ITRS projection. However, a relatively narrow range of lateral straggle lying between 7 to 8 nm is recommended. A sensitivity analysis of intrinsic delay, on-current and off-current to important parameters allows a comparative analysis of the various design options and shows that gate workfunction appears to be the most crucial parameter in the design of DG devices for all three technologies. The impact of back gate misalignment on Ion, Ioff and ? is also investigated for optimized underlap devices.

Bipolar effects in unipolar junctionless transistors

In this work, we analyze hysteresis and bipolar effects in unipolar junctionless transistors. A change in subthreshold drain current by 5 orders of magnitude is demonstrated at a drain voltage of 2.25 V in silicon junctionless transistor. Contrary to the conventional theory, increasing gate oxide thickness results in (i) a reduction of subthreshold slope (S-slope) and (ii) an increase in drain current, due to bipolar effects. The high sensitivity to film thickness in junctionless devices will be most crucial factor in achieving steep transition from ON to OFF state.

Optimization of the source/drain extension region profile for suppression of short channel effects in sub-50 nm DG MOSFETs with high-κ gate dielectrics

In the present paper, we propose a new scaling theory to model short channel effects (SCEs) in nanoscale double gate (DG) SOI MOSFETs, addressing two important technological issues—source/drain extension (SDE) region engineering and high-κ gate dielectrics. The impact of SDE region engineering through the optimization of lateral source/drain doping gradient and spacer width on SCEs is extensively analysed in DG devices with high-κ gate dielectrics, using the analytical model and 2D device simulations. Novel technology dependent scaling parameters, i.e., spacer-to-gradient ratio (ρ) and effective channel length (Leff), are proposed for source/drain-engineered DG MOSFETs, and their significance in minimizing SCEs in high-κ gate dielectrics is discussed in detail. Results show that the optimal spacer-to-gradient ratio should be increased with the permittivity of high-κ dielectrics in order to maintain SCEs to an acceptable level. The results of the analytical model confirm well with simulated data over the entire range of spacer widths, doping gradients, high-κ gate dielectrics and effective channel lengths. The present work provides valuable design insights in the performance of nanoscale source/drain-engineered DG SOI devices with high-κ gate dielectrics and serves as an accurate tool to optimize important device parameters aiding technology development.

Nonclassical Channel Design in MOSFETs for Improving OTA Gain-Bandwidth Trade-Off

In this paper, gain-bandwidth (GB) trade-off associated with analog device/circuit design due to conflicting requirements for enhancing gain and cutoff frequency is examined. It is demonstrated that the use of a nonclassical source/drain (S/D) profile (also known as underlap channel) can alleviate the GB trade-off associated with analog design. Operational transconductance amplifier (OTA) with 60 nm underlap S/D MOSFETs achieve 15 dB higher open loop voltage gain (AVO_OTA) along with three times higher cutoff frequency (fT_OTA) as compared to OTA with classical nonunderlap S/D regions. Underlap design provides a methodology for scaling analog devices into the sub-100 nm regime and is advantageous for high temperature applications with OTA, preserving functionality up to 540 K. Advantages of underlap architecture over graded channel (GC) or laterally asymmetric channel (LAC) design in terms of GB behavior are demonstrated. Impact of transistor structural parameters on the performance of OTA is also analyzed. Results show that underlap OTAs designed with spacer-to-straggle (s/ σ) ratio of 3.2 and operated below a bias current (IBIAS) of 80 μA demonstrate optimum performance. The present work provides new opportunities for realizing future ultra wide band OTA design with underlap DG MOSFETs in silicon-on-insulator (SOI) technology.

6-T SRAM cell design with nanoscale double-gate SOI MOSFETs: impact of source/drain engineering and circuit topology

The impact of source/drain engineering on the performance of a six-transistor (6-T) static random access memory (SRAM) cell, based on 22 nm double-gate (DG) SOI MOSFETs, has been analyzed using mixed-mode simulation, for three different circuit topologies for low voltage operation. The trade-offs associated with the various conflicting requirements relating to read/write/standby operations have been evaluated comprehensively in terms of eight performance metrics, namely retention noise margin, static noise margin, static voltage/current noise margin, write-ability current, write trip voltage/current and leakage current. Optimal design parameters with gate-underlap architecture have been identified to enhance the overall SRAM performance, and the influence of parasitic source/drain resistance and supply voltage scaling has been investigated. A gate-underlap device designed with a spacer-to-straggle (s/σ) ratio in the range 2–3 yields improved SRAM performance metrics, regardless of circuit topology. An optimal two word-line double-gate SOI 6-T SRAM cell design exhibits a high SNM ~ 162 mV, Iwr ~ 35 µA and low Ileak ~ 70 pA at VDD = 0.6 V, while maintaining SNM ~ 30%VDD over the supply voltage (VDD) range of 0.4–0.9 V.

Bipolar snapback in junctionless transistors for capacitorless dynamic random access memory

In this work, we analyze the snapback effect and extract the effective bipolar current gain in junctionless nanotransistors. The optimal electron and hole concentrations required to trigger and sustain bipolar snapback in junctionless transistors have been evaluated. The occurrence of snapback at lower drain bias (≅ 2 V) in junctionless devices in comparison to conventional inversion mode transistors demonstrates the enormous potential for static power reduction in capacitorless dynamic random access memories. High values (40–70) of effective bipolar current gain achieved in optimally designed junctionless transistors can be utilized to improve the sensing margin for dynamic memories.

Source/drain engineered ultra low power analog/RF UTBB MOSFETs

We present a novel optimization technique for ultra-low-power analog/RF Ultra Thin Body BOX (UTBB) MOSFETs. UTBB devices are optimized in bias range corresponding to peak of transconductance-to-current ratio (g<inf>m</inf>/I<inf>ds</inf>) and cut-off frequency (f<inf>T</inf>) product i.e. g<inf>m</inf>f<inf>T</inf>/I<inf>ds</inf> as it represents a “sweet spot” between speed and power. It is demonstrated that the use of underlap source/drain (S/D) architecture in UTBB devices improve g<inf>m</inf>f<inf>T</inf>/I<inf>ds</inf>, intrinsic voltage gain (A<inf>VO</inf>), cut-off frequency (f<inf>T</inf>) and linearity (VIP<inf>3</inf>) with downscaling.