Gao Chaoqun

A substrate-free optical readout focal plane array with a heat sink structure

A substrate-free optical readout focal plane array (FPA) operating in 8–12 μm with a heat sink structure (HSS) was fabricated and its performance was tested. The temperature distribution of the FPA with an HSS investigated by using a commercial FLIR IR camera shows excellent uniformity. The thermal cross-talk effect existing in traditional substrate-free FPAs was eliminated effectively. The heat sink is fabricated successfully by electroplating copper, which provides high thermal capacity and high thermal conductivity, on the frame of substrate-free FPA. The FPA was tested in the optical-readout system, the results show that the response and NETD are 13.6 grey/K (F / # = 0.8) and 588 mK, respectively.

Novel photoresist stripping technology using steam-water mixture

A novel wet vapor photoresist stripping technology is developed as an alternative to dry plasma ashing and wet stripping. Experiments using this technology to strip hard baked SU-8 photoresist, aurum and chromium film are carried out. Then the images of stripping results are shown and the mechanism is analyzed and discussed. The most striking result of this experiment is that the spraying mixture of steam and water droplets can strip photoresist and even metal film with ease.

Supercritical carbon dioxide process for releasing stuck cantilever beams

The multi-SCCO2 (supercritical carbon dioxide) release and dry process based on our specialized SCCO2 semiconductor process equipment is investigated and the releasing mechanism is discussed. The experiment results show that stuck cantilever beams were held up again under SCCO2 high pressure treatment and the repeatability of this process is nearly 100%.