Jing Yupeng

Novel photoresist stripping technology using steam-water mixture

A novel wet vapor photoresist stripping technology is developed as an alternative to dry plasma ashing and wet stripping. Experiments using this technology to strip hard baked SU-8 photoresist, aurum and chromium film are carried out. Then the images of stripping results are shown and the mechanism is analyzed and discussed. The most striking result of this experiment is that the spraying mixture of steam and water droplets can strip photoresist and even metal film with ease.

Supercritical carbon dioxide process for releasing stuck cantilever beams

The multi-SCCO2 (supercritical carbon dioxide) release and dry process based on our specialized SCCO2 semiconductor process equipment is investigated and the releasing mechanism is discussed. The experiment results show that stuck cantilever beams were held up again under SCCO2 high pressure treatment and the repeatability of this process is nearly 100%.

A method to restrain the charging effect on an insulating substrate in high energy electron beam lithography

Pattern distortions caused by the charging effect should be reduced while using the electron beam lithography process on an insulating substrate. We have developed a novel process by using the SX AR-PC 5000/90.1 solution as a spin-coated conductive layer, to help to fabricate nanoscale patterns of poly-methyl-methacrylate polymer resist on glass for phased array device application. This method can restrain the influence of the charging effect on the insulating substrate effectively. Experimental results show that the novel process can solve the problems of the distortion of resist patterns and electron beam main field stitching error, thus ensuring the accuracy of the stitching and overlay of the electron beam lithography system. The main characteristic of the novel process is that it is compatible to the multi-layer semiconductor process inside a clean room, and is a green process, quite simple, fast, and low cost. It can also provide a broad scope in the device development on insulating the substrate, such as high density biochips, flexible electronics and liquid crystal display screens.