David V. Caletka | Researchain

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Publication

Featured researches published by David V. Caletka.

Archive | 2002

Electronic package and method of forming

David V. Caletka; Eric A. Johnson

Archive | 1998

Thermally enhanced and mechanically balanced flip chip package and method of forming

David V. Caletka; Jean Dery; Eric Duchesne; Michael A. Gaynes; Eric A. Johnson; James R. Wilcox

Archive | 2001

Method of forming BGA interconnections having mixed solder profiles

David V. Caletka; Eric A. Johnson

Archive | 2003

Land grid array stiffener use with flexible chip carriers

David V. Caletka; Krishna Darbha; William Infantolino; Eric A. Johnson

Archive | 2003

Partially captured oriented interconnections for BGA packages and a method of forming the interconnections

David V. Caletka; Eric A. Johnson

Archive | 2004

Structure to accommodate increase in volume expansion during solder reflow

David V. Caletka; Krishna Darbha; Donald W. Henderson; Lawrence P. Lehman; George H. Thiel

Archive | 2001

Enhanced electrical/mechanical connection for electronic devices

William L. Brodsky; David V. Caletka; Michael A. Gaynes; Voya R. Markovich

Archive | 1997

Electronic component test apparatus with rotational probe and conductive spaced apart means

David J. Alcoe; David V. Caletka

Archive | 1997

Elastomeric structure with multi-layered elastomer and constraining base

David J. Alcoe; William L. Brodsky; David V. Caletka

Archive | 2001

Method for producing a reliable BGA solder joint interconnection

David V. Caletka; Kevin T. Knadle; Charles G. Woychik

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Collaboration

Dive into the David V. Caletka's collaboration.

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Eric A. Johnson

IBM

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Krishna Darbha

IBM

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William L. Brodsky

IBM

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David J. Alcoe

IBM

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Donald W. Henderson

IBM

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George H. Thiel

IBM

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Lawrence P. Lehman

IBM

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Charles R. Ramsey

IBM

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Gary Hugh Irish

IBM

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Gordon C. Osborne

IBM

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