Germar Schneider

Automated planning and creation of simulation experiments with a domain specific ontology for semiconductor manufacturing AMHS

To successfully manufacture logic and power semiconductors in existing high mix semiconductor factories, fast ramp up phases and frequent product changes are necessary. Especially for power semiconductor production, new manufacturing and automation concepts are required, e.g. regarding the use of other substrates than silicon wafers. To allow a judgment on how an existing automated material handling system (AMHS) can cope with the new challenges or which alterations are required, a material flow simulation is essential. However, the planning and creation of such simulation experiments is difficult because of the systems complexity, the large amount of boundary conditions and the effort of manually modifying and testing many different variants, partially using currently unforeseen automation concepts. In order to assist in this process, the authors suggest a method for rapidly creating valid simulation experiments using an ontology that allows for the reuse of previous experiments and system experts knowledge.

Einfluss- und Erfolgsfaktoren auf den Ramp Up in der Halbleiterindustrie

Der zunehmend harter werdende Wettbewerb fordert von Unternehmen der High Tech Branche vor allem Innovationskraft und damit eng verbunden kurzere Markteinfuhrungszeiten. Unter diesem Zeitdruck wird der Serienanlauf, auch als Ramp Up bezeichnet, in seiner Funktion als Schnittstelle zwischen Entwicklung und Produktion zu einer bedeutenden Grose im Produktentstehungsprozess. Im Rahmen dieses Beitrages werden erstmals fur die Halbleiterindustrie Einfluss- und Erfolgsfaktoren des Ramp Up vorgestellt. Hierbei nimmt die Logistik aufgrund ihrer Querschnittsfunktion eine besondere Rolle ein.

Managing variability within wafertest production by combining lean and six sigma

Manufacturing organization in the manner of flow production is one of the best solutions to achieve short cycle times, low inventories and a high delivery reliability, which are vital for commercial success. Variability within all production, support and organizational processes is one of the main detractors for establishing a continuous material flow in semiconductor manufacturing. In this contribution an approach for identification, classification, observation, reduction, mastering and even elimination of variability is shown. This is done by combining elements as well as tools of lean manufacturing and six sigma. The approach is validated by a case study in a wafertest environment and enables establishing the Virtual Time based Flow Principle.

Innovation and manufacturing excellence in mature multi-product semiconductor fabrication facilities via design for flow by 3

Bringing manufacturing excellence and innovation into balance, like yin and yang, in mature multi-product semiconductor fabrication facilities is the scope of the paper. This is done with the new approach called “Design for Flow by 3” which includes Product Process of Record (POR), Production Control, and organizational Design for Flow. It is derived out of the challenge to face the increasing pressure to combine efficiency goals and the speeding up of innovation. Therefore, industry specific approaches of optimization are left behind to adapt new ones from other industries. As a result, an iterative introduction of flow production, fulfilling the aforementioned requirements is depicted.

Identifikation von Ablauffamilien zur Integration flussorientierter Fertigungsstrukturen in der Halbleiterproduktion

Sehr kurze Produktlebenszyklen und ein starker Preisverfall fordern von Unternehmen der High Tech Branche hohe Innovationsgeschwindigkeit und kurze Markteinfuhrungszeiten. Kurze Durchlaufzeiten ermoglichen durch kurze Lernzyklen einen erfolgreichen Serienanlauf. Flussorientierte Fertigungsorganisationen fuhren zu kurzen Durchlaufzeiten und werden seit vielen Jahrzehnten mit grosem Erfolg z.B. in der Automobilindustrie eingesetzt. Im Gegensatz hierzu sind nahezu alle weltweit bekannten Fabrikationsstatten fur die Chip-Herstellung auch heute noch nach dem Verrichtungsprinzip organisiert. Die raumliche und organisatorische Zusammenfassung gleichartiger Maschinen ermoglicht zwar eine gute Nutzung der Ressourcen fur die Prozessentwicklung und Produktion, nachteilig sind jedoch die hohen Bestande, langen Durchlaufzeiten und geringe Termintreue. Eine Grundvoraussetzung fur die Anwendung des Flussprinzips und eine materialflussgerechte Reorganisation der Fertigung ist die Identifikation von Produkten mit identischen bzw. ahnlichen Fertigungsablaufen und ihre Zusammenfassung zu Ablauffamilien. Schwerpunkt des Beitrags ist die Vorstellung eines auf der Clusteranalyse basierenden Verfahrens zur Identifikation von Ablauffamilien.

Pursuing the Increase of Factory Automation in 200mm Frontend Manufacturing to Manage the Changes Imposed by the Transitionfrom High-Volume Low-Mix to High-Mix Low-Volume Production

We regard the stringent adoption of factory automation as the right strategy to efficiently leverage a 200 mm fabs competitiveness. In this article we exemplarily show how the Dresden fab cut its own path in the face of the transition challenge from a high-volume low-mix fab to a high-mix low-volume fab. We discuss the advantages of our conveyor type transport system with respect to our automation strategy and its extendibility to direct tool loading. A comparison of our transport system with typical 300 mm performance data and current ITRS requirements [1] is presented. We describe the positive influence of the taken factory automation measures on typical key manufacturing indicators like cycle time, tool utilization, head count efficiency, variability improvement, cost efficiency and quality.

Contamination Control for Wafer Container Used within 300 mm Manufacturing for Power Microelectronics

This paper gives an overview about all activities performed within a common project between industrial and academic partners to define clean room concepts for the first worldwide high volume semiconductor front end facility IFD for 300 mm power semiconductors. The investigation within this study is the base for the 300 mm container strategy resulting in new innovative manufacturing and automation concepts.

Reducing simulation model complexity by using an adjustable base model for path-based automated material handling systems: a case study in the semiconductor industry

Usually simulation studies of automated material handling systems of semiconductor fabs are extremely time consuming. This is due to the high detail of models used for investigations which are partly provided by transportation system suppliers. These models only provide poor possibilities for adjustment and are computationally expensive. The article will address these issues by proposing an adjustable supplier-independent base simulation model. It allows easy building, adjusting, and running simulation models of path-based systems without deeper programming knowledge. A use case of Infineons Dresden fab revealed simulation results with an accuracy in the same range as the supplier models while disregarding a few details and thus showing significant time savings in modeling and adjusting the system as well as running simulation studies. This can be done by choosing an appropriate level of abstraction.

Advanced contamination control methods for yield enhancement

Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and inorganic compounds allows monitoring of contamination in front- as well as back-end processes. In this way, cross contaminations including precious metals, e.g. Au, Ag, Pd, organic and inorganic compounds e.g. sulfur, fluorine can be avoided. By the use of state-of-the-art analytical systems, a contamination control for any cleanroom and all wafer sizes could be implemented.

Use of simulation studies to overcome key challenges in the fab automation of a 300 mm power semiconductor pilot line comprising thin-wafer processing

Infineon Technologies Dresden establishes the worldwide first highly automated high volume production for power semiconductors based on 300 mm thin wafer technologies. For this special manufacturing platform, there are a lot of challenges for manufacturing and automation. During the research phases in preparation for the future 300 mm pilot lines different simulation studies for wafers, substrates and the existing transportation system are powerful methods to get out the best manufacturing and automation concepts for the future fabs. This article gives an overview of key challenges and shows ways how to overcome the obstacles using innovative manufacturing and automation applications optimized through smart simulation.