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international symposium on environmentally conscious design and inverse manufacturing | 2001

Overview of IMS project; next generation environmental friendly soldering technology "EFSOT"

Koji Serizawa; Masahide Okamoto; Hanae Shimokawa; Asao Nakano; Takanon Ninomiya

The 21st century can be called the era of the environment, and various efforts are being made to protect the global environment. For the materials used in the soldering of electronic circuits, there is also concern over the harmful effects of Pb, which is an important component of those materials, and so there is a trend to eliminate the Pb component. Under this background, and founded on the recognized importance of developing an alternative connection technology that has little environmental impact and harm, the IMS Project: Development of the Next Generation Environmental Friendly Soldering Technology began in June, 2000 in cooperation of industry and academia, and supported by the Ministry of Economy, Trade and Industry and the IMS (Intelligent Manufacturing Systems) Promotion Center. The project comprises four areas, which are evaluation of the impact of Pb-free soldering on the environment, evaluation of the safety of the metals with respect to living creatures, recycling technology, and the development of production technology. To achieve a worldwide consensus and application, the project is being internationalized.


Archive | 1995

Electric appliance, printed circuit board, remained life estimation method, and system thereof

Tasao Soga; Hanae Shimokawa; Masahide Harada; Tatsuya Suzuki; Yuji Ochiai; Asao Nakano; Hiroyoshi Matsumura; Tsuneaki Kamei


Archive | 2002

Semiconductor device having solder bumps reliably reflow solderable

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 2001

Electron device and semiconductor device

Tasao Soga; Hanae Shimokawa; Tetsuya Nakatsuka; Masato Nakamura; Yuji Fujita; Toshiharu Ishida; Masahide Okamoto; Koji Serizawa; Toshihiro Hachiya; Hideki Mukuno


Archive | 1997

Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same

Tetsuya Nakatsuka; Tasao Soga; Hanae Shimokawa; Kenichi Yamamoto; Masahide Harada; Yuuji Ochiai; Tsuneaki Kamei


Archive | 2002

Pb-free solder-connected structure and electronic device

Hanae Shimokawa; Tasao Soga; Hiroaki Okudaira; Toshiharu Ishida; Tetsuya Nakatsuka; Yoshiharu Inaba; Asao Nishimura


Archive | 2001

Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 1999

Method and apparatus of manufacturing an electronic circuit board

Tasao Soga; Toshiharu Ishida; Tetsuya Nakatsuka; Hanae Shimokawa; Koji Serizawa; Yasuo Amano; Suguru Sakaguchi; Hiroshi Yamaguchi


Archive | 2001

Semiconductor module and circuit substrate

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Materials Transactions | 2002

Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder

Hanae Shimokawa; Tasao Soga; Koji Serizawa

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