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Featured researches published by Koji Serizawa.


Journal of Occupational Health | 2005

Oral toxicity of bismuth in rat: Single and 28-day repeated administration studies

Keiko Asakura; Hiroshi Satoh; Momoko Chiba; Masahide Okamoto; Koji Serizawa; Makiko Nakano; Kazuyuki Omae

Oral Toxicity of Bismuth in Rat: Single and 28‐Day Repeated Administration Studies: Yuri Sano, et al. Department of Preventative Medicine and Public Health, School of Medicine, Keio University—The consumption and production of bismuth are increasing, however there is very little information about the direct toxic effect of bismuth. The present study aimed to characterize the potential toxic effects of bismuth through oral administration and observation for fourteen days following single dose of 0 and 2,000 mg/kg (acute oral toxicity study), and repeated oral administration for twenty‐eight days at dose levels of 0, 40, 200, and 1,000 mg/kg daily (28‐d repeated oral dose toxicity study) to male and female Crj:CD (SD) IGS rats (SPF). We found no deaths and no abnormalities in clinical signs, body weights, and necropsy findings for any of the animals in the acute oral toxicity study and no changes attributable to bismuth in either males or females in the dose group up to 1,000 mg/kg of the 28‐d repeated‐dose toxicity study. Therefore, we determined that the lethal dose with a 50% mortality rate (LD50) is greater than 2,000 mg/kg and the no‐observed‐adverse‐effect level (NOAEL) of bismuth is 1,000 mg/kg in both sexes. We conclude that the adverse toxic effects of bismuth as a simple metal substance are low compared to lead toxicity under the conditions tested in our studies.


Journal of Occupational Health | 2009

Genotoxicity Studies of Heavy Metals: Lead, Bismuth, Indium, Silver and Antimony

Keiko Asakura; Hiroshi Satoh; Momoko Chiba; Masahide Okamoto; Koji Serizawa; Makiko Nakano; Kazuyuki Omae

Genotoxicity Studies of Heavy Metals: Lead, Bismuth, Indium, Silver and Antimony: Keiko Asakura, et al. Department of Preventive Medicine and Public Health, Keio University School of Medicine


Journal of Occupational Health | 2005

A 13-Week Toxicity Study of Bismuth in Rats by Intratracheal Intermittent Administration

Yuri Sano; Hiroshi Satoh; Momoko Chiba; Atsuko Shinohara; Masahide Okamoto; Koji Serizawa; Hiroshi Nakashima; Kazuyuki Omae

A 13‐Week Toxicity Study of Bismuth in Rats by Intratracheal Intermittent Administration: Yuri Sano, et al. Department of Preventative Medicine and Public Health, School of Medicine, Keio University—Although bismuth is widely used as a lead substitute in the industrial field, the toxicity of bismuth by inhalation is little known. We performed a 13‐wk intratracheal intermittent bismuth dose toxicity study. Bismuth was administered at dose levels of 0, 0.8, 4, 20 mg/kg to male Crj:CD(SD)IGS rats (SPF) by intratracheal intermittent administration once a week for thirteen weeks to investigate its potential toxic effects; especially for specific adverse effects and changes related to pre‐neoplastic lesions. Our results showed foreign body inflammation in the lungs, which was caused by intratracheal administration of bismuth, and physical changes related to pulmonary lesions; however, there were no serious changes in other organs. We concluded that dose‐dependent, but not specific adverse effects, were attributable to bismuth inhalation in the rat.


international symposium on environmentally conscious design and inverse manufacturing | 2005

Thermal Fatigue Life of Sn-2Ag Solder Bump with Small Al Addition

Koji Serizawa; K. Yoshimi; Masahide Okamoto; T. Narita; J. Tanaka

Recently, in accordance with environmental demands, Pb-free solders are being widely used. Our research was done to further promote the use of Pb-free solders. And it is tried to improve the thermal fatigue life by adding a small amount of Al to conventional Sn-Ag Pb-free solders. Ceramic ball grid arrays (C-BGAs), whose uses will increase in the future, were selected as the most crucial issue in thermal fatigue. Moreover, Sn-Ag solder as the mother solder alloy is used, to which we added a 0.1 and 0.05% wt. of Al. There were two kinds of fatigue fracture. In the first, the crack propagates inside the solder bump, and in the second, the crack propagates near the jointed solder and substrate interface. The fatigue life showed considerable improvement for the first mode, but no improvement for the second


international symposium on environmentally conscious design and inverse manufacturing | 2005

Overall Technological Results of IMS-EFSOT Japanese Project --- Environmental Impact of Lead-Free Soldering ---

Masahide Okamoto; Koji Serizawa; H. Satoh; M. Chiba; T. Takamatsu; N. Itsubo; A. Inaba

As for lead-free solder, jointability (workability and joint reliability) is not only evaluated but also energy consumption i.e. CO 2 emission, toxicity, resource depletion, recyclability and reusability of various types of solder. Next it is attempted to integrate the environmental impacts of these factors of each solder and compare them among these solders. Finally some types of solder whose integrated environmental impact was assumed to be relatively low is recommended. Sn-Ag-Cu and Sn-Cu types of solder as the best solutions in the present state is recommended. That is, total environmental impact of these solders is minimum, although they have a problem of Ag and Sn scarce. Then, suggested it was necessary to construct recycling system of Ag and Sn in the long term. 2nd Selection was Sn-Zn(-Bi) type solder. This solder has only problem about jointability. If this problem should be solved by improvement, this solder would be one of the best selections of lead-free solder. Furthermore refraining from use of Sb containing solder and In containing solder because of their toxicity and scarce respectively is proposed


international symposium on environmentally conscious design and inverse manufacturing | 2001

Overview of IMS project; next generation environmental friendly soldering technology "EFSOT"

Koji Serizawa; Masahide Okamoto; Hanae Shimokawa; Asao Nakano; Takanon Ninomiya

The 21st century can be called the era of the environment, and various efforts are being made to protect the global environment. For the materials used in the soldering of electronic circuits, there is also concern over the harmful effects of Pb, which is an important component of those materials, and so there is a trend to eliminate the Pb component. Under this background, and founded on the recognized importance of developing an alternative connection technology that has little environmental impact and harm, the IMS Project: Development of the Next Generation Environmental Friendly Soldering Technology began in June, 2000 in cooperation of industry and academia, and supported by the Ministry of Economy, Trade and Industry and the IMS (Intelligent Manufacturing Systems) Promotion Center. The project comprises four areas, which are evaluation of the impact of Pb-free soldering on the environment, evaluation of the safety of the metals with respect to living creatures, recycling technology, and the development of production technology. To achieve a worldwide consensus and application, the project is being internationalized.


Archive | 2002

Semiconductor device having solder bumps reliably reflow solderable

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 2001

Electron device and semiconductor device

Tasao Soga; Hanae Shimokawa; Tetsuya Nakatsuka; Masato Nakamura; Yuji Fujita; Toshiharu Ishida; Masahide Okamoto; Koji Serizawa; Toshihiro Hachiya; Hideki Mukuno


Archive | 1997

Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof

Ichiro Miyano; Koji Serizawa; Hiroyuki Tanaka; Tadao Shinoda; Suguru Sakaguchi


Archive | 2001

Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka

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