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Dive into the research topics where Kazuma Miura is active.

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Featured researches published by Kazuma Miura.


Corrosion Science | 2002

Corrosion of tin alloys in sulfuric and nitric acids

Masato Mori; Kazuma Miura; Takeshi Sasaki; Toshiaki Ohtsuka

Abstract To obtain a fundamental understanding of the corrosion behavior of lead-free solder, the corrosion behavior of tin-based eutectic alloys in sulfuric and nitric acids saturated with oxygen was investigated. The presence of bismuth in a Sn–Bi alloy (43Sn–57Bi (wt.%)) slightly accelerated the preferential dissolution of tin instead of dissolving itself in 0.05 M H 2 SO 4 and greatly accelerated, in 0.1 M HNO 3 compared with that of pure tin. In both acids, dissolution of both tin and zinc from a Sn–Zn alloy (91Sn–9Zn (wt.%)) occurred depending on the ratio of composition, and dissolution of tin from a Sn–Ag alloy (96.5Sn–3.5Ag (wt.%)) was accelerated. Dipping tests in H 2 SO 4 and HNO 3 of pH 4 showed that dissolution of only zinc and lead occurred, suggesting that the tin-based alloys investigated in this study are preferable to substitutes for lead solders in terms of corrosion resistance.


Corrosion Science | 2003

Corrosion products of tin in humid air containing sulfur dioxide and nitrogen dioxide at room temperature

Takeshi Sasaki; Ryoji Kanagawa; Toshiaki Ohtsuka; Kazuma Miura

Abstract To obtain a fundamental understanding of the corrosion behavior of tin in corrosive gas environments, in situ infrared reflection absorption spectroscopy measurements were carried out on tin in humid air containing SO2 and NO2 at room temperature. A series of time-resolved in situ IR spectra in air of 90% relative humidity (RH) containing 10–22 ppm SO2 suggested that the oxide films on tin specimens had a protective effect and that no significant corrosion occurred. The corrosion products in air of 80–90% RH containing 10–22 ppm NO2 were SnO2, SnO, nitrate and hyponitrite. The synergistic effect of SO2 and NO2 on corrosion of tin was not observed in humid air (RH of 90%) containing 0.84 ppm SO2 and 1.8 ppm NO2.


Archive | 2002

Semiconductor device having solder bumps reliably reflow solderable

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 2002

Product using Zn-Al alloy solder

Tasao Soga; Toshiharu Ishida; Kazuma Miura; Hanae Hata; Masahide Okamoto; Tetsuya Nakatsuka


Archive | 2001

Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 2005

Method for producing product made of stainless steel, and the product made of stainless steel

Daisuke Kuroda; Kazuma Miura; Mitsuo Watanabe; Shinichi Yanatori; 一真 三浦; 新一 梁取; 光雄 渡辺; 大介 黒田


Archive | 2001

Semiconductor module and circuit substrate

Kazuma Miura; Hanae Shimokawa; Koji Serizawa; Tasao Soga; Tetsuya Nakatsuka


Archive | 2001

PRODUCT USING Zn-Al BASED SOLDER

Hideyoshi Hata; Toshiharu Ishida; Kazuma Miura; Tetsuya Nakatsuka; Masahide Okamoto; Tasao Soga; 一真 三浦; 哲也 中塚; 正英 岡本; 太佐男 曽我; 寿治 石田; 英恵 秦


Archive | 2002

Semiconductor device with lead-free solder

Tasao Soga; Hanae Shimokawa; Tetsuya Nakatsuka; Kazuma Miura; Mikio Negishi; Hirokazu Nakajima; Tsuneo Endoh


Archive | 2001

Bonding device, bonding method and magnetic head

Kazuma Miura; Isao Sato; Koji Serizawa; 一真 三浦; 勲 佐藤; 弘二 芹沢

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