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HanGil Shin

STATS ChipPAC Ltd

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Publication

Featured researches published by HanGil Shin.

Archive | 2010

Integrated circuit packaging system with encapsulation and method of manufacture thereof

HeeJo Chi; NamJu Cho; HanGil Shin

Archive | 2012

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

HeeJo Chi; NamJu Cho; HanGil Shin

Archive | 2009

Integrated circuit packaging system with encapsulated via and method of manufacture thereof

NamJu Cho; HeeJo Chi; HanGil Shin

Archive | 2009

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

NamJu Cho; HeeJo Chi; HanGil Shin; Rui Huang; Seng Guan Chow; Heap Hoe Kuan

Archive | 2012

Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint

HeeJo Chi; NamJu Cho; HanGil Shin

Archive | 2009

Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof

HanGil Shin; HeeJo Chi; A Leam Choi

Archive | 2010

Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die

NamJu Cho; HeeJo Chi; HanGil Shin

Archive | 2011

Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects

NamJu Cho; HeeJo Chi; HanGil Shin

Archive | 2010

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

HeeJo Chi; NamJu Cho; HanGil Shin

Archive | 2010

Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof

NamJu Cho; HeeJo Chi; HanGil Shin

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Collaboration

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HeeJo Chi

STATS ChipPAC Ltd

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NamJu Cho

STATS ChipPAC Ltd

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In Sang Yoon

STATS ChipPAC Ltd

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Jae Han Chung

STATS ChipPAC Ltd

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A Leam Choi

STATS ChipPAC Ltd

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Kyung Moon Kim

STATS ChipPAC Ltd

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Kyung-Moon Kim

STATS ChipPAC Ltd

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Soo Jung Park

STATS ChipPAC Ltd

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Daesik Choi

STATS ChipPAC Ltd

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DeokKyung Yang

STATS ChipPAC Ltd

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