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Dive into the research topics where Harald Kraus is active.

Publication


Featured researches published by Harald Kraus.


Meeting Abstracts | 2007

Modifications of Porous Low-k by Plasma Treatments and Wet Cleans

Kaidong Xu; Guy Vereecke; Els Kesters; QuocToan Le; Marcel Lux; Sally-Ann Henry; Harald Kraus; Leo Archer; P. Mertens; Frederic Kovacs; Michael Dalmer; Ernst Gaulhofer; Shijian Luo; Qingyuan Han; Ivan Berry

With the implementation of Cu and low-κ dielectrics in back-end-of-line (BEOL), issues arise in every process step that must be addressed. One of the challenges is the susceptibility of Cu and low-κ materials to attack during residue removal (polymer) after low-κ etch and resist strip. This work focuses on the influence of the plasma etch and ash processes on compatibility of porous low-κ dielectrics with a selection of wet chemistries that are used for BEOL polymer removal.


Archive | 2005

Method for selective etching

Harald Kraus; M. Claes


Meeting Abstracts | 2007

Post Salicidation Clean: Selective Removal of Un-Reacted NiPt Towards NiPtSi(Ge)

Kaidong Xu; Anne Lauwers; Rita Vos; Leo Archer; Harald Kraus; Caroline Demeurisse; Sofie Mertens; Sally-Ann Henry; Glenn W. Gale; P. Mertens; Frederic Kovacs; Michael Dalmer; Ernst Gaulhofer


Semiconductor Fabtech | 2005

Selective single-wafer wet etching of Hf-based layers

Jim Snow; Harald Kraus; F Kovacs; Martine Claes; Vasile Paraschiv; Rita Vos; Paul Mertens; Stefan De Gendt; Marc Heyns; Leo Archer


Archive | 2004

Method for determining the effectiveness of silicon nitride as a barrier layer for HfO2

Harald Kraus; Jim Snow; Patrick Van Doorne; Wim Fyen; Paul Mertens; Frederic Kovacs


Archive | 2004

Drying of hydrophobic surfaces - one of the keys for future technologies

Harald Kraus; Jim Snow; Paul Mertens; Frank Holsteyns; Karine Kenis; F Kovacs; S Fichtl


Archive | 2004

Advanced wafer surface cleaning technology

Paul Mertens; Rita Vos; Guy Vereecke; Sophia Arnauts; Twan Bearda; Rita De Waele; Atsuro Eitoku; Wim Fyen; J Geckiere; David Hellin; Frank Holsteyns; Els Kesters; Martine Claes; Karine Kenis; Harald Kraus; Stephane Malhouitre; Kun-tack Lee; Michael Kocsis; Bart Onsia; Sylvain Garaud; Jens Rip; Jim Snow; Ivo Teerlinck; Jan Van Hoeymissen; Francesca Barbagini; Kaidong Xu; Vasile Paraschiv; Stefan De Gendt; G. Mannaert; Marc Heyns


Archive | 2004

Selective wet removal of Hf-based layers and post-dry etch residues high-k and metal gate

Martine Claes; Vasile Paraschiv; S. Beckx; Marc Demand; Wim Deweerd; Sylvain Garaud; Harald Kraus; Rita Vos; Jim Snow; Werner Boullart; Stefan De Gendt


Archive | 2004

Selective wet etching of Hf-based layers on a single-wafer spin processor

Harald Kraus; F Kovacs; Jim Snow; Martine Claes; Vasile Paraschiv; Rita Vos; Paul Mertens; Stefan De Gendt; Marc Heyns


Archive | 2004

Rinsing and drying issues during the post CMP cleaning process

Wim Fyen; Kaidong Xu; Jan Van Steenbergen; Guy Vereecke; Rita Vos; Sophia Arnauts; Jens Rip; Karine Kenis; Frank Holsteyns; David Hellin; Geert Doumen; Paul Mertens; Harald Kraus; Kim Lee

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Jim Snow

Katholieke Universiteit Leuven

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Paul Mertens

Katholieke Universiteit Leuven

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Kaidong Xu

Katholieke Universiteit Leuven

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Stefan De Gendt

Katholieke Universiteit Leuven

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