Harald Pötter

RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz

RF-MEMS technology is emerging as a key enabling solution to address demanding requirements that upcoming 5G standards pose upon passive devices and networks. In this letter, we demonstrate experimentally-to the best of our knowledge, for the first time-, RF-MEMS 2-state basic attenuator modules, from nearly dc up to 110 GHz. Physical samples are realized in the CMM-FBK RF-MEMS technology, and design variations are tested. Resistive loads are placed in series or shunt configuration on the RF line, and the attenuation is ON/OFF switched by electrostatically driven MEMS micro-relays. Tested devices show attenuation levels (S21) from -5 to -10 dB, depending on the resistive load, with flatness of 2-3 dB from 10 MHz to 50 GHz and of ~2 dB from 60 up to 110 GHz. When OFF, the attenuator modules introduce loss (S21) better than -1 dB up to 50 GHz and better than -6 dB up to 110 GHz.

RF-MEMS Technology for Future Mobile and High-Frequency Applications: Reconfigurable 8-Bit Power Attenuator Tested up to 110 GHz

In this letter, we present and test-to the best of our knowledge, for the first time-, an 8-bit (256-state) reconfigurable RF-MEMS attenuator, from 10 MHz up to 110 GHz, realized in the CMM-FBK technology. Resistive loads, in series and shunt configuration, are selectively inserted on the RF line by means of electrostatic MEMS ohmic switches. The network exhibits several attenuation levels in the range of -10/-45 dB that are rather flat up to 50 GHz, and a certain number of configurations with VSWR smaller than 4 from nearly dc up to 110 GHz, and better than 2 on a frequency span of ~80 GHz.

Environmental aspects of PCB microintegration

Environmental problems caused by electronic products in connection with mass production and widespread use require growing attention from the public, the legislative and also from the manufacturers. Possibilities of environmental improvements are presented and assessed by means of a screening method based on the Toxic Potential Indicator. In these cases minimised products are more environmentally compatible. But in future the large-scale manufacturing processes for these products have to be taken into consideration.

Environmental screening of packaging and interconnection technologies

As a complement to life cycle assessment various environmental screening models have been developed. The screening parameter discussed in this paper addresses the toxicity of materials in electronic products. Obviously the material content of electronic assemblies is also needed for all other methods which distinguish down to the technology level and therefore serve as a starting point for more detailed environmental investigations. The modern packaging and interconnection technologies are driving forces behind the miniaturization of electronics in general and are used as parameters for a trend analysis of future electronics.

RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz

After fluctuating expectations and disillusionments, RF-MEMS technology is starting to make its way into market applications. To this regard, the upcoming field of 5G seems to be the fitting application area for such a technology to fully express its potential. In this work, we present an RF-MEMS basic 2-state attenuator module, simulated and measured up to 50 GHz. A series resistive load, inserted on the RF line, can be shorted by electrostatically actuating a suspended Gold thin membrane. When the load is inserted, a rather flat attenuation level (S21) is observed over the whole range, it spanning from -9 dB to -6 dB as the frequency increases. On the other hand, when shorted, the module exhibits a loss (S21) better than -1.4 dB up to 50 GHz. The discussed basic module can then be exploited as building block to implement more complex RF signal conditioning functions.

Towards the re-use of electronic products-quality assurance for the re-use of electronics

Work on reliability and life time estimation of new electronic components is an initial approach to find a solution for estimating the remaining life time of such components. A basis for this work is the soldered joint, because its fatigue is one of the main reasons for the failure of electronic circuits under normal operating conditions. In case of the remaining life time estimation, a statement for a single component has to be made which is submitted under unknown operating conditions during its life. In order to transfer the existing results of reliability and life time estimation of new electronic components, this problem has to be solved. The following issues are investigated: the state of the art in life cycle assessment research for electronic components with regard to an application in remaining life time assessment; the transferability of the results from above to the remaining life time assessment under the condition of a nondestructive measurement; and a low-cost method(s) for the nondestructive assessment of the remaining life time for printed circuit boards and components.

New processes and materials for semiconductor components

To date, public interest in the development of new electronic systems has been primarily focused on advances in semiconductor technology and microsystem technology. However, in coming years, attention will shift to approaches that flexibly, cost-effectively and reliably integrate semiconductors into a miniature system. In this article, the Fraunhofer Institutes for Reliability and Microintegration (IZM) discuss this trend, also known as heterointegration, which will require new manufacturing processes and materials.

Neue Verfahren und Werkstoffe für Halbleiterkomponenten

Bislang standen bei der Realisierung neuer elektronischer Systeme die Fortschritte im Bereich der Halbleitertechnologie oder Mikrosystemtechnik im Mittelpunkt des Interesses. In Zukunft werden hingegen Ansatze fokussiert, die Halbleiterkomponenten flexibel, kostengunstig und zuverlassig zu einem miniaturisierten System zusammenfassen konnen. Das Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (IZM) beschreibt diesen, auch Heterointegration genannten Trend, der durch neue Fertigungsverfahren und Werkstoffe erst ermoglicht wird.

Challenging the Future

Microelectronics, on the surface, appears as a clean high technology industry, which creates benefits for mankind. It is estimated that the worldwide sales of electronic products in 1998 was over 1 trillion U.S. dollars. The electronics industry is therefore perceived as a very successful industry. This success, however, takes the electronics industry to the environmental limits: the increased electronic devices require increased resources and the growing amounts of emissions and waste from electronic devices burden the environment.

Design for environment in automotive electronic design

The increasing number of automotive applications is one of the driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources, this trend seems to be inherently benign for the environment. Adverse effects overlay this simple truth. The overall amount of electronics in a car multiplies. The complexity and closeness of nonseparable compounds increase. The decentralization of automotive electronics is a major handicap for recycling at the end of car lifetime. This aspect becomes increasingly important, since car producers are forced by the government (e.g. since April 1st 1998 in Germany) to take back old cars. Similar to the information and communications industry, it can be expected that car producers ask their suppliers about the environmental aspects of their products. In this paper, an overview of international tendencies in design for environment are given.