Harsaran Singh Bhatia

Electrical design of an MCM package for a multi-processor digital system

The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system has been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper. >

Advanced design and modeling for manufacturability of a hybrid MCM package

The objective of this paper is to focus on manufacturability aspects of the MCM package through advanced design and modeling techniques. Two types of modeling are discussed: electrical and process. Use of electrical modeling to enhance manufacturability is demonstrated. Process modeling is driven by the requirements to maximize yield. A Poisson model which relates the product complexity and process characteristics to electrical yield are discussed. Three phases of advanced design techniques, namely cube design, substrate design and thin film design are shown to reduce cycle time and also manufacturing defects. >