Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Harumi Negishi is active.

Publication


Featured researches published by Harumi Negishi.


2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) | 2002

Low-transmission-loss modified cyanate ester materials for high-frequency applications

Daisuke Fujimoto; Yasuyuki Mizuno; Nozomu Takano; Shigeo Sase; Harumi Negishi; Takeshi Sugimura

Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.


Archive | 2005

Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same

Kenichi Tomioka; Hiroshi Shimizu; Nobuyuki Minami; Harumi Negishi; Shinichi Chikusei Kamoshida


Archive | 1998

Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same

Shigeo Sase; Yasuyuki Mizuno; Takeshi Sugimura; Harumi Negishi


Archive | 2004

THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL-CLAD LAMINATE AND PRINTED WIRING BOARD USING THE SAME

Shinichi Kamoshita; Nobuyuki Minami; Harumi Negishi; Hiroshi Shimizu; Kenichi Tomioka; 宜行 南; 健一 富岡; 春巳 根岸; 浩 清水; 真一 鴨志田


Archive | 2005

Thermosetting resin composition and prepreg, metal-coated laminate board and wiring board using the same

Shinichi Kamoshita; Nobuyuki Minami; Harumi Negishi; Hiroshi Shimizu; Kenichi Tomioka; 宜行 南; 健一 富岡; 春巳 根岸; 浩 清水; 真一 鴨志田


Archive | 2001

Modified cyanate ester based curable resin composition for laminate, and prepreg and laminate made by using it

Yasuyuki Mizuno; Harumi Negishi; Shigeo Sase; Takeshi Sugimura; 茂雄 佐瀬; 猛 杉村; 春巳 根岸; 康之 水野


Archive | 2005

Adhesive composition, multi-layered printed circuit board using the adhesive composition and method for producing multi-layered printed circuit board

Shinichi Kamoshita; Harumi Negishi; 春巳 根岸; 真一 鴨志田


Archive | 2000

Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the composition

Shigeo Sase; Yasuyuki Mizuno; Takeshi Sugimura; Harumi Negishi


Archive | 2000

Method for producing phenol-modified cyanate ester resin composition, phenol-modified cyanate ester resin composition obtained by the method and prepreg and metal laminate using the same

Harumi Negishi; Takeshi Sugimura; 猛 杉村; 春巳 根岸


Archive | 2006

Adhesive resin composition, multilayer printed wiring board using the adhesive resin composition and method for producing the multilayer printed wiring board

Shinichi Kamoshita; Harumi Negishi; 春巳 根岸; 真一 鴨志田

Collaboration


Dive into the Harumi Negishi's collaboration.

Researchain Logo
Decentralizing Knowledge