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2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) | 2002

Low-transmission-loss modified cyanate ester materials for high-frequency applications

Daisuke Fujimoto; Yasuyuki Mizuno; Nozomu Takano; Shigeo Sase; Harumi Negishi; Takeshi Sugimura

Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.


Archive | 1996

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

Nozomu Takano; Shigeo Sase; Tomio Fukuda; Michitoshi Arata


Archive | 1979

Process for preparing foundry cores or molds and binder materials used therefor

Susumu Konii; Shigeo Sase; Masatoshi Yoshida; Shoei Kuroda; Takeshi Sumi


Archive | 1998

Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same

Shigeo Sase; Yasuyuki Mizuno; Takeshi Sugimura; Harumi Negishi


Archive | 2000

Composition having function to improve display quality and element for improving display quality using the same

Hiroyuki Kawakami; Takeshi Nojiri; Shoichi Sasaki; Shigeo Sase; Mariko Shimamura; Seiji Tai; Toshishige Uehara; 寿茂 上原; 晶市 佐々木; 茂雄 佐瀬; 真理子 島村; 広幸 川上; 誠司 田井; 剛 野尻


Archive | 1997

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PREPREG, METAL-CLAD LAMINATE USING THE SAME

Michitoshi Arata; Tomio Fukuda; Shigeo Sase; Mare Takano; 茂雄 佐瀬; 富男 福田; 道俊 荒田; 希 高野


Archive | 2001

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

Nozomu Takano; Shigeo Sase; Tomio Fukuda; Michitoshi Arata


Archive | 2000

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole

Michitoshi Arata; Shigeo Sase; Nozomu Takano; Tomio Fukuda


Archive | 2006

Tire condition monitor device and method of manufacturing the same

Satoshi Pacific Industrial Co. Ltd. Morita; Akira Pacific Industrial Co. Ltd. Momose; Naoki Hara; Shigeo Sase


Archive | 1997

Epoxy composition for printed circuit boards

Michitoshi Arata; Shigeo Sase; Nozomu Takano; Tomio Fukuda

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