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Heap Hoe Kuan

STATS ChipPAC Ltd

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Publication

Featured researches published by Heap Hoe Kuan.

Archive | 2008

Stacked integrated circuit package system

Seng Guan Chow; Heap Hoe Kuan; Dioscoro A. Merilo; Antonio B. Dimaano

Archive | 2009

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Reza A. Pagaila; Heap Hoe Kuan; Dioscoro A. Merilo

Archive | 2006

Integrated circuit package-on-package stacking system

Dioscoro A. Merilo; Heap Hoe Kuan; You Yang Ong; Seng Guan Chow; Ma. Shirley Asoy

Archive | 2008

Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference

Reza A. Pagaila; Byung Tai Do; Heap Hoe Kuan; Rui Huang

Archive | 2009

Wafer Level Integration Package

Heap Hoe Kuan; Seng Guan Chow; Linda Pei Ee Chua

Archive | 2007

Package-on-Package Using Through-Hole Via Die on Saw Streets

Byung Tai Do; Heap Hoe Kuan; Seng Guan Chow

Archive | 2009

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Rui Huang; Heap Hoe Kuan; Yaojian Lin; Seng Guan Chow

Archive | 2008

Embedded semiconductor die package and method of making the same using metal frame carrier

Il Kwon Shim; Seng Guan Chow; Heap Hoe Kuan

Archive | 2008

Integrated circuit package system for stackable devices

Seng Guan Chow; Rui Huang; Heap Hoe Kuan

Archive | 2009

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

NamJu Cho; HeeJo Chi; HanGil Shin; Rui Huang; Seng Guan Chow; Heap Hoe Kuan

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Collaboration

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Seng Guan Chow

STATS ChipPAC Ltd

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Byung Tai Do

STATS ChipPAC Ltd

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Rui Huang

STATS ChipPAC Ltd

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Linda Pei Ee Chua

STATS ChipPAC Ltd

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Il Kwon Shim

STATS ChipPAC Ltd

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Dioscoro A. Merilo

STATS ChipPAC Ltd

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Reza A. Pagaila

STATS ChipPAC Ltd

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Yaojian Lin

STATS ChipPAC Ltd

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Antonio B. Dimaano

STATS ChipPAC Ltd

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Hin Hwa Goh

STATS ChipPAC Ltd

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