Reza A. Pagaila

Integrated circuit packaging system with package stacking and method of manufacture thereof

Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference

Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device