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Linda Pei Ee Chua

STATS ChipPAC Ltd

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Publication

Featured researches published by Linda Pei Ee Chua.

Archive | 2009

Wafer Level Integration Package

Heap Hoe Kuan; Seng Guan Chow; Linda Pei Ee Chua

Archive | 2012

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Reza A. Pagaila; Byung Tai Do; Linda Pei Ee Chua

Archive | 2010

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Linda Pei Ee Chua; Byung Tai Do; Reza A. Pagaila

Archive | 2010

Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material

Reza A. Pagaila; Linda Pei Ee Chua; Byung Tai Do

Archive | 2009

Semiconductor Package Having Through-Hole Via on Saw Streets Formed with Partial Saw

Byung Tai Do; Heap Hoe Kuan; Linda Pei Ee Chua

Archive | 2007

Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer

Byung Tai Do; Heap Hoe Kuan; Linda Pei Ee Chua

Archive | 2012

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

Reza A. Pagaila; Byung Tai Do; Linda Pei Ee Chua

Archive | 2008

Integrated circuit package system with penetrable film adhesive

Seng Guan Chow; Linda Pei Ee Chua; Heap Hoe Kuan

Archive | 2007

Method of making a wafer level integration package

Heap Hoe Kuan; Seng Guan Chow; Linda Pei Ee Chua

Archive | 2011

Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets

Reza A. Pagaila; Linda Pei Ee Chua; Byung Tai Do

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Collaboration

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Byung Tai Do

STATS ChipPAC Ltd

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Arnel Senosa Trasporto

STATS ChipPAC Ltd

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Reza A. Pagaila

STATS ChipPAC Ltd

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Heap Hoe Kuan

STATS ChipPAC Ltd

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Seng Guan Chow

STATS ChipPAC Ltd

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Rui Huang

STATS ChipPAC Ltd

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Dioscoro A. Merilo

STATS ChipPAC Ltd

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Asri Yusof

STATS ChipPAC Ltd

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Henry Descalzo Bathan

STATS ChipPAC Ltd

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Sung Soo Kim

STATS ChipPAC Ltd

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