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Hideki Tokuyama

Fujitsu

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Publication

Featured researches published by Hideki Tokuyama.

Archive | 2003

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

Archive | 2003

RESIN SEAL MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR

Takeru Nakagawa; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 浩 浦上; 慎二 高瀬

Archive | 2002

Method and device for sealing and forming resin of electronic component

Shinji Takase; Hideki Tokuyama; 秀樹 徳山; 慎二 高瀬

Archive | 2002

Method of sealing with resin, method of manufacturing semiconductor device, and resin material

Kinya Fujino; Noboru Hayasaka; Koichi Meguro; Takeru Nakagawa; Toru Nishino; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 昇 早坂; 浩 浦上; 弘一 目黒; 欣也 藤野; 徹 西野; 慎二 高瀬

Archive | 2002

Method for molding electronic part by resin sealing and metal mold

Shinji Takase; Hideki Tokuyama; 秀樹 徳山; 慎二 高瀬

Archive | 2004

Resin sealing and molding method, and device for electronic component

Takeaki Ko; Yohei Onishi; Hideki Tokuyama; 洋平 大西; 秀樹 徳山; 丈明 高

Archive | 2011

METHOD AND DEVICE FOR MANUFACTURING SUBSTRATE WITH REFLECTOR

Kazuteru Kawakubo; 一輝 川窪; Hideki Tokuyama; 秀樹 徳山; Yusuke Hirata; 雄亮 平田

Archive | 2015

Method and apparatus for supplying semiconductor substrate

Hideki Tokuyama; Shinji Takase

Archive | 2014

Apparatus for manufacturing molded articles, method for manufacturing molded article and molded article

Kazuki Kawakubo; Hideki Tokuyama; Yusuke Hirata

Archive | 2013

Method and device for supplying semiconductor substrate to semiconductor sealing mold

徳山 秀樹; Hideki Tokuyama; 秀樹 徳山; 高瀬 慎二; Shinji Takase; 慎二 高瀬

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Shinji Takase

Fujitsu

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Hiroshi Uragami

Fujitsu

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Kinya Fujino

Fujitsu

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Koichi Meguro

Fujitsu

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Noboru Hayasaka

Fujitsu

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Toru Nishino

Fujitsu

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Osamu Nakagawa

Fujitsu

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