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Dive into the research topics where Hiroshi Uragami is active.

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Featured researches published by Hiroshi Uragami.


Archive | 2003

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka


Archive | 2003

RESIN SEAL MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR

Takeru Nakagawa; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 浩 浦上; 慎二 高瀬


Archive | 2002

Method of sealing with resin, method of manufacturing semiconductor device, and resin material

Kinya Fujino; Noboru Hayasaka; Koichi Meguro; Takeru Nakagawa; Toru Nishino; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 昇 早坂; 浩 浦上; 弘一 目黒; 欣也 藤野; 徹 西野; 慎二 高瀬


Archive | 2012

Method for manufacturing resin-sealed electronic component and device for manufacturing resin-sealed electronic component

Hiroshi Uragami; 浦上 浩; Keita Mizuma; 敬太 水間; Ichitaro Okamoto; 一太郎 岡本; Naoki Takada; 直毅 高田; Mamoru Nakamura; 中村 守; Shinsuke Yasuda; 信介 安田


Archive | 2008

Method of compression molding for electronic part and apparatus therefor

Tsuyoshi Amakawa; Shinji Takase; Yohei Onishi; Hiroshi Uragami; Naoki Takada; Osamu Otsuki; Mamoru Oda


Archive | 2008

Method and apparatus for compression molding

Shigeru Hirata; Masanobu Takahashi; Hiroshi Uragami; 滋 平田; 浩 浦上; 政信 高橋


Archive | 2007

Resin Sealing/Molding Apparatus

Hiroshi Uragami; Mamoru Nakamura; Masanobu Takahashi; Kinya Fujino; Katsunori Tsutafuji


Archive | 2011

COMPRESSION MOLDING METHOD AND COMPRESSION MOLDING APPARATUS

Hiroshi Uragami; Masanobu Takahashi; Shigeru Hirata


Archive | 2006

RESIN SEALING MOLDING DEVICE OF SEMICONDUCTOR CHIP

Katsunori Dento; Kinya Fujino; Mamoru Nakamura; Masanobu Takahashi; Hiroshi Uragami; 守 中村; 勝則 傳藤; 浩 浦上; 欣也 藤野; 政信 高橋


Archive | 2015

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

Hirokazu Okada; Hiroshi Uragami; Tsuyoshi Amakawa; Muneo Miura

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