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Featured researches published by Koichi Meguro.


Archive | 2003

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka


Archive | 2002

Method of manufacturing semiconductor device using heated conveyance member

Takao Ohno; Koichi Meguro; Shigeru Kamada; Keisuke Fukuda; Yuzo Shimobeppu


Archive | 2002

Method of sealing with resin, method of manufacturing semiconductor device, and resin material

Kinya Fujino; Noboru Hayasaka; Koichi Meguro; Takeru Nakagawa; Toru Nishino; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 昇 早坂; 浩 浦上; 弘一 目黒; 欣也 藤野; 徹 西野; 慎二 高瀬


Archive | 2004

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material

Koichi Meguro; Shinji Takase; Kinya Fujino


Archive | 2002

Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portion

Koichi Meguro; Keisuke Fukuda; Yuzo Shimobeppu; Takao Ohno


Archive | 2012

Wafer level package structure and manufacturing method of the same

Koichi Meguro; Kanji Otsuka; 寛治 大塚; 弘一 目黒


Archive | 2011

METHOD FOR CHIP PACKAGE

Lei Shi; Yujuan Tao; Guohua Gao; Naomi Masuda; Koichi Meguro


Archive | 2012

WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Koichi Meguro; Kanji Otsuka


Archive | 2011

Method for chip packaging

Lei Shi; Guohua Gao; Yujuan Tao; Naomi Masuda; Koichi Meguro


Archive | 2004

Verfahren zum Vergießen mit Harz, Verwendung des genannten Verfahrens zum Herstellen eines Halbleiterbauteils sowie Harzmaterial für das Verfahren

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

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