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Kinya Fujino

Fujitsu

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Publication

Featured researches published by Kinya Fujino.

Archive | 2003

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

Archive | 2002

Method of sealing with resin, method of manufacturing semiconductor device, and resin material

Kinya Fujino; Noboru Hayasaka; Koichi Meguro; Takeru Nakagawa; Toru Nishino; Shinji Takase; Hideki Tokuyama; Hiroshi Uragami; 長 中川; 秀樹 徳山; 昇 早坂; 浩 浦上; 弘一 目黒; 欣也 藤野; 徹 西野; 慎二 高瀬

Archive | 2007

Resin Sealing/Molding Apparatus

Hiroshi Uragami; Mamoru Nakamura; Masanobu Takahashi; Kinya Fujino; Katsunori Tsutafuji

Archive | 2004

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material

Koichi Meguro; Shinji Takase; Kinya Fujino

Archive | 2006

RESIN SEALING MOLDING DEVICE OF SEMICONDUCTOR CHIP

Katsunori Dento; Kinya Fujino; Mamoru Nakamura; Masanobu Takahashi; Hiroshi Uragami; 守 中村; 勝則 傳藤; 浩 浦上; 欣也 藤野; 政信 高橋

Archive | 2007

Method and device for resin seal molding of optical element

Kinya Fujino; Kazuteru Kawakubo; Mamoru Nakamura; Hiroshi Uragami; Tetsuya Yamada; 守 中村; 哲也 山田; 一輝 川窪; 浩 浦上; 欣也 藤野

Archive | 2004

Verfahren zum Vergießen mit Harz, Verwendung des genannten Verfahrens zum Herstellen eines Halbleiterbauteils sowie Harzmaterial für das Verfahren

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

Archive | 2003

Verfahren zum Vergießen mit Harz sowie Harzmaterial für das Verfahren A method of casting resin and resin material for the process

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

Archive | 2003

A method of sealing with resin, and the resin material for the process

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

Archive | 2003

Method and apparatus for sealing resin, method for manufacturing semiconductor device, semiconductor device and resin material, enabling dissolved resin to uniformly flow over the whole area on surface parallel to substrate and to flow in depth direction of cavity within very short time

Hiroshi Uragami; Osamu Nakagawa; Kinya Fujino; Shinji Takase; Hideki Tokuyama; Koichi Meguro; Toru Nishino; Noboru Hayasaka

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Collaboration

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Hiroshi Uragami

Fujitsu

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Koichi Meguro

Fujitsu

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Shinji Takase

Fujitsu

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Hideki Tokuyama

Fujitsu

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Noboru Hayasaka

Fujitsu

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Toru Nishino

Fujitsu

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Osamu Nakagawa

Fujitsu

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Tetsuya Yamada

Nagoya University

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哲也 山田

Kyushu University

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