Hideo Ota
Toshiba
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Hideo Ota.
japan international electronic manufacturing technology symposium | 1995
Hideo Ota; S. Fujieda; T. Okuyama; A. Yoshizumi
This paper describes a new encapsulating method using resin sheets. In this method, uncured resin sheets are placed on both sides of semiconductor chip, and inserted into heated molds. The resin sheets placed on the chip are fused and fill up the mold cavity. Then the resin is cured. This method is very suitable for fabricating packages which are as thin as 0.3 mm. Such thin model packages achieved high reliability under pressure cooker test and thermal cycle test.
Archive | 1994
Shinetsu Fujieda; Sadao Kajiura; Tetsuo Okuyama; Hideo Ota; Akira Yoshizumi; 章 善積; 英男 太田; 哲生 奥山; 貞夫 梶浦; 新悦 藤枝
Archive | 1996
Yasuyuki Hotta; Shigeru Matake; Tetsuo Okuyama; Hideo Ota; 康之 堀田; 英男 太田; 哲生 奥山; 茂 真竹
Archive | 1997
Shinetsu Fujieda; Yasuyuki Hotta; Kazutaka Matsumoto; Tetsuo Okuyama; Hideo Ota; Hiromichi Takami; Akira Yoshizumi; 章 善積; 康之 堀田; 英男 太田; 哲生 奥山; 一高 松本; 新悦 藤枝; 博道 高見
Archive | 2000
Kiichi Ito; Hideo Ota; Toshiya Seko; Takashi Yanagihara; 敏也 世古; 喜一 伊藤; 英男 太田; 孝 柳原
Archive | 2000
Hideo Ota; 英男 太田
Archive | 1996
Hideo Ota; 英男 太田
Archive | 2000
Kiichi Ito; Hideo Ota; Toshiya Seko; Takashi Yanagihara; 敏也 世古; 喜一 伊藤; 英男 太田; 孝 柳原
Archive | 2006
Naoya Hayamizu; Jun Monma; Yoshihiko Nakano; Hideo Ota; Akiko Saito; Yukihiro Shibata; Kazuhiro Yasuda; 義彦 中野; 英男 太田; 一浩 安田; 幸弘 柴田; 直哉 速水; 旬 門馬; 晶子 齋藤
Archive | 2007
Naoya Hayamizu; Jun Monma; Yoshihiko Nakano; Hideo Ota; Akiko Saito; Kazuhiro Yasuda; 義彦 中野; 英男 太田; 一浩 安田; 直哉 速水; 旬 門馬; 晶子 齋藤
