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Dive into the research topics where Hirokazu Ezawa is active.

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Featured researches published by Hirokazu Ezawa.


Archive | 1990

Method and device for plating semiconductor wafer

Hirokazu Ezawa; Takemasa Ohira; Manabu Tsujimura; Toru Watanabe


Archive | 2004

Electroless Ni-B plating liquid, electronic device and method for manufacturing the same

Hiroaki Inoue; Kenji Nakamura; Moriji Matsumoto; Hirokazu Ezawa; Masahiro Miyata; Manabu Tsujimura


Archive | 2000

Forming method of electrode

Hirokazu Ezawa; Masahiro Miyata; 雅弘 宮田; 弘和 江澤


Archive | 2005

Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor device

Susumu Harada; Chiaki Takubo; Kenji Takahashi; Hideo Aoki; Hideo Numata; Hisashi Kaneko; Hirokazu Ezawa; Mie Matsuo; Hiroshi Ikenoue; Ichiro Omura


Archive | 1999

WIRING FORMING METHOD FOR SEMICONDUCTOR DEVICE

Hirokazu Ezawa; Seita Fukuhara; Masako Kinoshita; Hiroshi Kosukegawa; Katsuiku Shiba; Atsushi Shigeta; Yoshikuni Tateyama; Keiichi Watanabe; Katsumi Yamamoto; 広志 小助川; 克美 山本; 正子 木下; 克育 柴; 弘和 江澤; 佳一 渡辺; 成太 福原; 佳邦 竪山; 厚 重田


Microelectronic Engineering | 2013

Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM

Hirokazu Ezawa; Takashi Togasaki; Tatsuo Migita; Soichi Yamashita; Masahiro Inohara; Yasuhiro Koshio; Masatoshi Fukuda; Masahiro Miyata; Kohei Tatsumi


Archive | 2004

THIN FILM SUBSTRATE HOLDING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Hideo Aoki; Hirokazu Ezawa; Susumu Harada; Hiroshi Ikegami; Hisafumi Kaneko; Mie Matsuo; Hideo Numata; Ichiro Omura; Kenji Takahashi; Tomoaki Takubo; 享 原田; 一郎 大村; 美恵 松尾; 弘和 江澤; 浩 池上; 英夫 沼田; 知章 田窪; 尚史 金子; 秀夫 青木; 健司 高橋


Archive | 1997

Barrier layer for semiconductor substrate wiring

Hirokazu Ezawa; Hiroaki Inoue; Naoaki Kogure; Masahiro Miyata; 裕章 井上; 雅弘 宮田; 直明 小榑; 弘和 江澤


Archive | 2012

Wafer supporting board, thin wafer holding method and manufacture of semiconductor device

Ichiro Omura; Hideo Aoki; Kenji Takahashi; Hirokazu Ezawa; Mie Matsuo; Susumu Harada; Hisashi Kaneko; Hiroshi Ikenoue; Chiaki Takubo; Hideo Numata


電子情報通信学会技術研究報告. ICD, 集積回路 | 2005

Lead-free bumping and its process integrity for fine pitch interconnects

Hirokazu Ezawa; Masaharu Seto; Kazuhito Higuchi

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Kenji Takahashi

Tokyo Institute of Technology

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