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Dive into the research topics where Hiromitsu Maruyama is active.

Publication


Featured researches published by Hiromitsu Maruyama.


Archive | 2002

Pressure sensitive adhesive tape for use in laser dicing

Hiromitsu Maruyama; Toru Morita; Arimichi Tamagawa; Shozo Yano; 弘光 丸山; 徹 森田; 有理 玉川; 正三 矢野


Archive | 2008

Semiconductor wafer processing tape

Hiromitsu Maruyama; Shuzo Taguchi; Yasumasa Morishima; Shinichi Ishiwata


Archive | 2002

Antistatic dicing tape

Yoshihisa Kano; Hiromitsu Maruyama; Hidefumi Miyagi; Yasumasa Morishima; 弘光 丸山; 義久 加納; 秀文 宮城; 泰正 盛島


Archive | 2007

FILM FOR PROCESSING SEMICONDUCTOR WAFER

Shinichi Ishiwatari; Hiromitsu Maruyama; Yasumasa Morishima; Yosuke Ogawara; 弘光 丸山; 洋介 大河原; 泰正 盛島; 伸一 石渡


Archive | 2009

Film for wafer processing

Shinichi Ishiwatari; Kazuhiro Kimura; Hiromitsu Maruyama; Yasumasa Morishima; Yoshihiro Nomura; 弘光 丸山; 和寛 木村; 泰正 盛島; 伸一 石渡; 芳弘 野村


Archive | 2011

Tape for wafer processing, and method of manufacturing the same

Shinichi Ishiwatari; Hiromitsu Maruyama; Jiro Sugiyama; 弘光 丸山; 二朗 杉山; 伸一 石渡


Archive | 2008

Adhesive tape for processing semiconductor wafer

Yosuke Okawara; Hiromitsu Maruyama; Yasumasa Morishima; Shinichi Ishiwata


Archive | 2009

ROLL CORE AND WAFER PROCESSING TAPE WOUND AROUND THE ROLL CORE

Kazuhiro Kimura; Hiromitsu Maruyama; Toshimitsu Nakamura; 俊光 中村; 弘光 丸山; 和寛 木村


Archive | 2011

Winding core and wafer-processing belt wound on same

Kazuhiro Kimura; Hiromitsu Maruyama; Toshimitsu Nakamura


Archive | 2010

Wafer processing tape and method of manufacturing same

Shinichi Ishiwatari; Hiromitsu Maruyama; Jiro Sugiyama; 弘光 丸山; 二朗 杉山; 伸一 石渡

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泰正 盛島

The Furukawa Electric Co.

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Shuzo Taguchi

The Furukawa Electric Co.

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Noboru Sakuma

The Furukawa Electric Co.

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Yoshihisa Kano

Tokyo University of Agriculture and Technology

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