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Dive into the research topics where Shinichi Ishiwata is active.

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Featured researches published by Shinichi Ishiwata.


Journal of Adhesion | 2000

Acrylate Copolymer/Ultraviolet Curable Oligomer Blends as Pressure-sensitive Adhesives

Takehiro Ozawa; Shinichi Ishiwata; Yoshihisa Kano; Tomoyuki Kasemura

Abstract For the blends of acrylate copolymer [poly(2-ethylhexyl acrylate-co-acrylic acid); P(2EHA-AA)] with ultraviolet (UV) curable oligomer [urethane acrylate oligomer; UAO], pressure-sensitive adhesive (PSA) properties, such as peel adhesion, probe tack, and holding power were examined. The values of peel adhesion and probe tack of the P(2EHA-AA)/UAO blends were dramatically reduced by UV irradiation. On the other hand, all blends had a high holding power even if these blends were cured by UV irradiation. The mechanism of reduced PSA properties was investigated via dynamic mechanical properties, DSC, and dynamic contact angle (DCA). The peel adhesion decreased monotonically with increasing storage modulus, E′, and loss modulus, E″, for all non-UV and UV-cured blends. Since modulus values and glass transition temperatures, Tg, of these blends after UV irradiation were higher than those of these blends before UV irradiation, we judged that the reduced peel adhesion and probe tack values were caused by the modulus increase and the Tg increase due to UV irradiation. In other words, the ability of the deformation energy of UV-cured blends to influence the adhesive tests was reduced by the curing process. The DCAs of non-UV-cured blends were the same as those of UV-cured blends. We presumed that the segment mobility of the polymer chain on the surface did not contribute to the reduced peel adhesion and probe tack values.


Archive | 2012

Wafer processing tape

Kenji Kita; Yasumasa Morishima; Shinichi Ishiwata; Akira Yabuki


Archive | 1988

Radiation-curable adhesive tape

Shinichi Ishiwata; Michio Ueyama; Hiroyuki Nakae; Yoshiyuki Funayama; Kazushige Iwamoto; Isamu Noguchi


Archive | 2007

Method of producing a semiconductor device, and wafer-processing tape

Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata; Takanori Yamakawa


Archive | 1993

Semiconductor wafer-securing adhesive tape

Koji Nakayama; Kenji Mougi; Eiji Shiramatsu; Kazushige Iwamoto; Shinichi Ishiwata; Morikuni Hasebe


Archive | 2005

Dicing/die bonding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata


Archive | 2005

Dicing/die boding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata


Archive | 1992

A surface-protection method during etching

Shinichi Ishiwata; Kazushige Iwamoto; Michio Ueyama; Isamu Noguchi


Archive | 2006

Wafer-processing tape and method of producing the same

Kenji Kita; Yasumasa Morishima; Shinichi Ishiwata


Archive | 2008

Semiconductor wafer processing tape

Hiromitsu Maruyama; Shuzo Taguchi; Yasumasa Morishima; Shinichi Ishiwata

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Kenji Kita

The Furukawa Electric Co.

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Isamu Noguchi

The Furukawa Electric Co.

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Michio Ueyama

The Furukawa Electric Co.

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Akira Yabuki

The Furukawa Electric Co.

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Hiroyuki Nakae

The Furukawa Electric Co.

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Masakatsu Inada

The Furukawa Electric Co.

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