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Hiroomi Torii

Ebara Corporation

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Publication

Featured researches published by Hiroomi Torii.

Archive | 2007

Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device

Nobuyuki Takahashi; Hiroaki Nishida; Hiroomi Torii; Soichi Isobe; Tadakazu Sone; Ryuichi Kosuge; Hiroyuki Kaneko; Hiroshi Sotozaki; Takao Mitsukura; Takahiro Ogawa; Kenichi Sugita

Archive | 2006

Substrate delivery mechanism

Soichi Isobe; Hideo Aizawa; Hiroomi Torii; Daisuke Koga; Satoshi Wakabayashi

Archive | 2007

Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus

Nobuyuki Takahashi; Hiroaki Nishida; Hiroomi Torii; Soichi Isobe; Tadakazu Sone; Ryuichi Kosuge; Hiroyuki Kaneko; Hiroshi Sotozaki; Takao Mitsukura; Takahiro Ogawa; Kenichi Sugita

Archive | 2006

Polishing platen and polishing apparatus

Takuji Kobayashi; Hideo Aizawa; Masao Umemoto; Tadakazu Sone; Hiroomi Torii; Nobuyuki Takahashi; Takashi Tsuzuki

Archive | 2012

Method of operating substrate processing apparatus and substrate processing apparatus

Hiroomi Torii; Hiroaki Nishida; Hiroyuki Kaneko; Misao Date; Takashi Mitsuya; Takamasa Nakamura

Archive | 2006

Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method

Nobuyuki Takahashi; Tadakazu Sone; Takuji Kobayashi; Hiroomi Torii

Archive | 2005

Wafer delivery device, polishing unit, and wafer receiving method

Takuji Kobayashi; Chuichi Sone; Nobuyuki Takahashi; Hiroomi Torii; 卓二 小林; 忠一 曽根; 信行 高橋; 弘臣 鳥居

Archive | 2003

Substrate delivery method, a substrate delivery mechanism and a substrate polishing apparatus

Soichi Isobe; Hideo Aizawa; Hiroomi Torii; Daisuke Koga; Satoshi Wakabayashi

Archive | 2002

SUBSTRATE DELIVERY METHOD, SUBSTRATE DELIVERY MECHANISM, AND SUBSTRATE POLISHING DEVICE

Hideo Aizawa; Soichi Isobe; Daisuke Koga; Hiroomi Torii; Satoshi Wakabayashi; 古賀 大輔; 相澤 英夫; 磯部 壮一; 若林 聡; 鳥居 弘臣

Archive | 2003

Polishing apparatus and method of bonding and removing expendable replacement components thereof

Hiroomi Torii; Hideo Aizawa; Satoshi Wakabayashi

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Collaboration

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Soichi Isobe

Ebara Corporation

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Hiroaki Nishida

Ebara Corporation

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Hiroyuki Kaneko

Ebara Corporation

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Tadakazu Sone

Ebara Corporation

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Hideo Aizawa

Ebara Corporation

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Takuji Kobayashi

Ebara Corporation

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Nobuyuki Takahashi

Newcastle University

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Satoshi Wakabayashi

Ebara Corporation

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Daisuke Koga

Ebara Corporation

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Hiroshi Sotozaki

Ebara Corporation

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