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Hsien-Pin Hu

TSMC

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Publication

Featured researches published by Hsien-Pin Hu.

Archive | 2015

Interposer Test Structures and Methods

Tzuan-Horng Liu; Chen-Hua Yu; Hsien-Pin Hu; Tzu-Yu Wang; Wei-Cheng Wu; Shang-Yun Hou; Shin-puu Jeng

Archive | 2010

INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME

Hsiao-Tsung Yen; Hsien-Pin Hu; Jhe-Ching Lu; Chin-Wei Kuo; Ming-Fa Chen; Sally Liu

Archive | 2010

3D inductor and transformer

Hsiao-Tsung Yen; Chin-Wei Kuo; Hsien-Pin Hu; Sally Liu; Ming-Fa Chen; Jhe-Ching Lu

Archive | 2010

Through-substrate via waveguides

Hsiao-Tsung Yen; Hsien-Pin Hu; Chin-Wei Kuo; Sally Liu

Archive | 2015

Testing of semiconductor chips with microbumps

Wei-Cheng Wu; Hsien-Pin Hu; Shang-Yun Hou; Shin-puu Jeng; Chen-Hua Yu; Chao-Hsiang Yang

Archive | 2013

Methods and Apparatus for Inductors and Transformers in Packages

Hsiao-Tsung Yen; Yu-Ling Lin; Chung-Yu Lu; Chin-Wei Kuo; Tzuan-Horng Liu; Hsien-Pin Hu; Min-Chie Jeng

Archive | 2015

Test structure and method of testing electrical characteristics of through vias

Shang-Yun Hou; Wei-Cheng Wu; Hsien-Pin Hu; Jung Cheng Ko; Shin-puu Jeng; Chen-Hua Yu; Kim Hong Chen

Archive | 2015

Methods and apparatus of packaging with interposers

Chung-Yu Lu; Hsien-Pin Hu; Hsiao-Tsung Yen; Tzuan-Horng Liu; Shih-Wen Huang; Shang-Yun Hou; Shin-puu Jeng

Archive | 2015

Mechanism for Forming Patterned Metal Pad connected to Multiple Through Silicon Vias (TSVs)

Tzuan-Horng Liu; Shih-Wen Huang; Chung-Yu Lu; Hsien-Pin Hu; Shang-Yun Hou; Shin-puu Jeng

Archive | 2017

Structure and Formation Method for Chip Package

Wen-Hsin Wei; Chi-Hsi Wu; Chen-Hua Yu; Hsien-Pin Hu; Shang-Yun Hou; Wei-Ming Chen

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Shang-Yun Hou

TSMC

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Hsiao-Tsung Yen

TSMC

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Chen-Hua Yu

TSMC

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Chin-Wei Kuo

TSMC

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Shin-puu Jeng

TSMC

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Sally Liu

TSMC

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Tzuan-Horng Liu

TSMC

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Chung-Yu Lu

TSMC

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Jhe-Ching Lu

TSMC

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Ming-Fa Chen

TSMC

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