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Hung-Jui Kuo

TSMC

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Publication

Featured researches published by Hung-Jui Kuo.

Archive | 2011

Photoactive Compound Gradient Photoresist

Chen-Hua Yu; Chung-Shi Liu; Hung-Jui Kuo

Archive | 2010

CONDUCTIVE PILLAR STRUCTURE FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE

Hung-Jui Kuo; Chung-Shi Liu; Chen-Hua Yu

Archive | 2011

CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS

Yi-Yang Lei; Hung-Jui Kuo; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2011

UBM Etching Methods for Eliminating Undercut

Yi-Yang Lei; Hung-Jui Kuo; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2010

Non-uniform alignment of wafer bumps with substrate solders

Hung-Jui Kuo; Chung-Shi Liu; Chen-Hua Yu

Archive | 2015

Staggered Via Redistribution Layer (RDL) for a Package

Chen-Hua Yu; Chung-Shi Liu; Hung-Jui Kuo

Archive | 2015

Staggered Via Redistribution Layer (RDL) for a Package and a Method for Forming the Same

Chen-Hua Yu; Chung-Shi Liu; Hung-Jui Kuo

Archive | 2016

SEMICONDCUTOR PACKAGE AND MANUFACTURING PROCESS THEREOF

Yu-feng Chen; Chih-Hua Chen; Chen-Hua Yu; Chung-Shi Liu; Hung-Jui Kuo; Hui-Jung Tsai; Hao-Yi Tsai

Archive | 2015

Housing with UBM and process for forming

Chen-Hua Yu; Chien-Yu Li; Hung-Jui Kuo; Li-Hsien Huang; Hsien-Wei Chen; Der-Chyang Yeh; Chung-Shi Liu; Shin-puu Jeng

Archive | 2015

Gehäuse mit UBM und Verfahren zum Bilden Housing with UBM and method of forming

Chen-Hua Yu; Chien-Yu Li; Hung-Jui Kuo; Li-Hsien Huang; Hsien-Wei Chen; Der-Chyang Yeh; Chung-Shi Liu; Shin-puu Jeng

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Collaboration

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Chen-Hua Yu

TSMC

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Chung-Shi Liu

TSMC

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Der-Chyang Yeh

TSMC

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Hsien-Wei Chen

TSMC

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Li-Hsien Huang

TSMC

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Mirng-Ji Lii

TSMC

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Shin-puu Jeng

TSMC

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Yi-Yang Lei

TSMC

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Chih-Hua Chen

TSMC

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Hao-Yi Tsai

TSMC

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