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Der-Chyang Yeh

TSMC

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Publication

Featured researches published by Der-Chyang Yeh.

Archive | 2013

Interconnect Structure for Package-on-Package Devices

Jui-Pin Hung; Jing-Cheng Lin; Po-Hao Tsai; Yi-Jou Lin; Shuo-Mao Chen; Chiung-Han Yeh; Der-Chyang Yeh

Archive | 2013

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Chen-Hua Yu; Shang-Yun Hou; Wen-Chih Chiou; Jui-Pin Hung; Der-Chyang Yeh; Chiung-Han Yeh

Archive | 2014

Package with Passive Devices and Method of Forming the Same

Shuo-Mao Chen; Der-Chyang Yeh; Li-Hsien Huang

Archive | 2012

Packages with Passive Devices and Methods of Forming the Same

Chen-Hua Yu; Shang-Yun Hou; Der-Chyang Yeh; Shuo-Mao Chen; Chiung-Han Yeh; Yi-Jou Lin

Archive | 2015

Structure and Method for 3D IC Package

Shang-Yun Hou; Der-Chyang Yeh; Shin-puu Jeng; Chen-Hua Yu

Archive | 2014

ELECTRIC MAGNETIC SHIELDING STRUCTURE IN PACKAGES

Chen-Hua Yu; Shin-puu Jeng; Der-Chyang Yeh; Hsien-Wei Chen; Jie Chen

Archive | 2012

Interposer System and Method

Chen-Hua Yu; Shin-puu Jeng; Shang-Yun Hou; Der-Chyang Yeh

Archive | 2015

SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SURFACE MOUNT DEVICE AND METHOD OF FORMING THE SAME

Hsien-Wei Chen; Ying-Ju Chen; Ming-Yen Chiu; Der-Chyang Yeh

Archive | 2014

Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices

Hsien-Wei Chen; Chi-Hsi Wu; Chen-Hua Yu; Der-Chyang Yeh; Wei-Cheng Wu; Chien-Fu Tseng

Archive | 2013

Method of fabricating interconnect structure for package-on-package devices

Jui-Pin Hung; Jing-Cheng Lin; Po-Hao Tsai; Yi-Jou Lin; Shuo-Mao Chen; Chiung-Han Yeh; Der-Chyang Yeh

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Chen-Hua Yu

TSMC

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Hsien-Wei Chen

TSMC

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Shin-puu Jeng

TSMC

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Chi-Hsi Wu

TSMC

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An-Jhih Su

TSMC

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Jui-Pin Hung

TSMC

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Wei-Cheng Wu

TSMC

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Li-Hsien Huang

TSMC

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Shang-Yun Hou

TSMC

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Shuo-Mao Chen

TSMC

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