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Hung-Yi Kuo

TSMC

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Publication

Featured researches published by Hung-Yi Kuo.

Archive | 2014

Capacitor in Post-Passivation structures and methods of forming the same

Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo; Tung-Liang Shao; Ying-Ju Chen; Tsung-Yuan Yu; Jie Chen

Archive | 2016

3D package with through substrate vias

Chen-Hua Yu; Mirng-Ji Lii; Hung-Yi Kuo; Hao-Yi Tsai; Chao-Wen Shih; Tsung-Yuan Yu; Min-chien Hsiao

Archive | 2012

Inductor for Post Passivation Interconnect

Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo; Jie Chen; Ying-Ju Chen; Tsung-Yuan Yu

Archive | 2017

InFO Coil on Metal Plate with Slot

Chuei-Tang Wang; Wei-Ting Chen; Vincent Chen; Hao-Yi Tsai; Ming Hung Tseng; Hung-Yi Kuo; Chen-Hua Yu

Archive | 2015

Inductor for Post Passivation Interconnect and A Method of Forming

Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo; Jie Chen; Ying-Ju Chen; Tsung-Yuan Yu

Archive | 2016

Inductor System and Method

Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo; Tsung-Yuan Yu

Archive | 2013

Single Mask Package Apparatus and Method

Chen-Hua Yu; Mirng-Ji Lii; Hao-Yi Tsai; Hsien-Wei Chen; Hung-Yi Kuo

Archive | 2017

Wireless Charging Package with Chip Integrated in Coil Center

Chiang-jui Chu; Chen-Hua Yu; Chung-Shi Liu; Hao-Yi Tsai; Ming Hung Tseng; Hung-Yi Kuo

Archive | 2017

INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURES AND METHODS OF FORMING SAME

Chang-Pin Huang; Chen-Hua Yu; Ching-Jung Yang; Chung-Shi Liu; Hsien-Ming Tu; Hung-Yi Kuo; Hao-Yi Tsai; Shih-Wei Liang; Yu-Chia Lai

Archive | 2017

FAN-OUT PACKAGE STRUCTURE, ANTENNA SYSTEM AND ASSOCIATED METHOD

Wei-Ting Chen; Tzu-Chun Tang; Ming Hung Tseng; In-Tsang Lin; Vincent Chen; Chuei-Tang Wang; Hung-Yi Kuo

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Collaboration

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Hao-Yi Tsai

TSMC

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Hsien-Wei Chen

TSMC

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Chen-Hua Yu

TSMC

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Jie Chen

TSMC

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Tsung-Yuan Yu

TSMC

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Ying-Ju Chen

TSMC

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Mirng-Ji Lii

TSMC

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Chung-Shi Liu

TSMC

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Ming Hung Tseng

TSMC

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Chang-Pin Huang

TSMC

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