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Tsung-an Yu

TSMC

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Publication

Featured researches published by Tsung-an Yu.

Archive | 2013

Interconnect Structures and Methods of Forming Same

Wen-Hsiung Lu; Hsuan-Ting Kuo; Tsung-Yuan Yu; Hsien-Wei Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2013

System and method for an improved interconnect structure

Hsien-Wei Chen; Hao-Yi Tsai; Mirng-Ji Lii; Chen-Hua Yu; Tsung-Yuan Yu

Archive | 2013

Apparatus and Method for Package Reinforcement

Hsien-Wei Chen; Tsung-Yuan Yu; Wen-Hsiung Lu; Ming-Da Cheng; Hao-Yi Tsai; Mirng-Ji Lii; Chen-Hua Yu

Archive | 2011

METHODS OF AND SEMICONDUCTOR DEVICES WITH BALL STRENGTH IMPROVEMENT

Tsung-Yuan Yu; Hsien-Wei Chen; Ying-Ju Chen; Shih-Wei Liang

Archive | 2013

Methods and Apparatus of Packaging of Semiconductor Devices

Hsien-Wei Chen; Tsung-Yuan Yu; Jie Chen; Ying-Ju Chen

Archive | 2016

Ball Amount Process in the Manufacturing of Integrated Circuit

Hsien-Wei Chen; Tsung-Yuan Yu; Wen-Hsiung Lu; Ming-Da Cheng

Archive | 2014

UBM structures for wafer level chip scale packaging

Tsung-Yuan Yu; Hsien-Wei Chen; Ying-Ju Chen; Shih-Wei Liang

Archive | 2012

Strain reduced structure for IC packaging

Hsien-Wei Chen; Ying-Ju Chen; Tsung-Yuan Yu; Yu-feng Chen; Tsung-Ding Wang

Archive | 2011

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

Ying-Ju Chen; Hsien-Wei Chen; Tsung-Yuan Yu; Shih-Wei Liang

Archive | 2013

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION INTERCONNECT STRUCTURE

Shih-Wei Liang; Hsien-Wei Chen; Ying-Ju Chen; Tsung-Yuan Yu; Mirng-Ji Lii

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Collaboration

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Hsien-Wei Chen

TSMC

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Ying-Ju Chen

TSMC

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Shih-Wei Liang

TSMC

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Hao-Yi Tsai

TSMC

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Mirng-Ji Lii

TSMC

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Chen-Hua Yu

TSMC

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Jie Chen

TSMC

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Ming-Da Cheng

TSMC

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Wen-Hsiung Lu

TSMC

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Chao-Wen Shih

TSMC

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