Hyun-Jun Yoon

A 64-Mbit, 640-MByte/s bidirectional data strobed, double-data-rate SDRAM with a 40-mW DLL for a 256-MByte memory system

A 64-Mbit bidirectional data strobed, double-data-rate SDRAM achieves a peak bandwidth of 2.56 GByte/s on a 64-bit-channel, 256-MByte memory system at V/sub cc/=3.3 V and T=25/spl deg/C. The circuit features are: (1) a bidirectional data strobing scheme to eliminate the clock-related skews of I/O data in a multimodule system, (2) a low-power delay-locked loop having a wide range of locking frequency (40-160 MHz) with fast access time and minimal variations, and (3) a twisted data bussing architecture with minimized loading difference between I/O data paths and small chip-size overhead associated with the 2-bit prefetch operation.

A 128 Gb 3b/cell V-NAND Flash Memory With 1 Gb/s I/O Rate

Most memory-chip manufacturers keep trying to supply cost-effective storage devices with high-performance characteristics such as shorter tPROG, lower power consumption and higher endurance. For many years, every effort has been made to shrink die size to lower cost and to improve performance. However, the previously used node-shrinking methodology is facing challenges due to increased cell-to-cell interference and patterning difficulties caused by decreasing dimension. To overcome these limitations, 3D-stacking technology has been developed. As a result of long and focused research in 3D stacking technology, we succeed in developing 128 Gb 3b/cell Vertical NAND with 32 stack WL layers for the first time, which is the smallest 128 Gb NAND Flash. The die size is 68.9 mm 2, program time is 700 us and I/O rate is 1 Gb/s.

A new 3-bit programming algorithm using SLC-to-TLC migration for 8MB/s high performance TLC NAND flash memory

We have developed a new 3-bit programming algorithm of high performance TLC(Triple-level-cell, 3-bit/cell) NAND flash memories for 20nm node and beyond. By using the proposed 3-bit algorithm based on reprogramming with SLC-to-TLC migration, performance and BER is improved by 50% and 68%, respectively, compared to conventional method. The proposed algorithm is successfully implemented in 21nm 64Gb TLC NAND flash product that provides 8MB/s write and 400MB/s read throughputs.

A 7MB/s 64Gb 3-bit/cell DDR NAND flash memory in 20nm-node technology

Recently, the demand for 3b/cell NAND flash has been increasing due to a strong market shift from 2b/cell to 3b/cell in NAND flash applications, such as USB disk drives, memory cards, MP3 players and digital still cameras that require cost-effective flash memory. To further expand the 3b/cell market, high write and read performances are essential [1]. Moreover, the device reliability requirements for these applications is a challenge due to continuing NAND scaling to sub-30nm pitches that increases cell-to-cell interference and disturbance. We present a high reliability 64Gb 3b/cell NAND flash with 7MB/s write rate and 200Mb/s asynchronous DDR interface in a 20m-node technology that helps to meet the expanding market demand and application requirement.

7.2 A 128Gb 3b/cell V-NAND flash memory with 1Gb/s I/O rate

Most memory-chip manufacturers keep trying to supply cost-effective storage devices with high-performance characteristics such as smaller tPROG, lower power consumption and longer endurance. For many years, every effort has been made to shrink die size to lower cost and to improve performance. However, the previously used node-shrinking methodology is facing challenges due to increased cell-to-cell interference and patterning difficulties caused by decreasing dimension. To overcome these limitations, 3D-stacking technology has been developed. As a result of long and focused research in 3D stacking technology, 128Gb 2b/cell device with 24 stack WL layers was announced in 2014 [1].

11.4 A 512Gb 3b/cell 64-stacked WL 3D V-NAND flash memory

The advent of emerging technologies such as cloud computing, big data, the internet of things and mobile computing is producing a tremendous amount of data. In the era of big data, storage devices with versatile characteristics are required for ultra-fast processing, higher capacity storage, lower cost, and lower power operation. SSDs employing 3D NAND are a promising to meet these requirements. Since the introduction of 3D NAND technology to marketplace in 2014 [1], the memory array size has nearly doubled every year [2,3]. To continue scaling 3D NAND array density, it is essential to scale down vertically to minimize total mold height. However, vertical scaling results in critical problems such as increasing WL capacitance and non-uniformity of stacked WLs due to variation in the channel hole diameter. To tackle these issues, this work proposes schemes for programming speed improvement and power reduction, and on-chip processing algorithms for error correction.

Feasibility of using Auto Mod‐MPI system, a novel technique for automated measurement of fetal modified myocardial performance index

To evaluate the reproducibility of measurement of the fetal left modified myocardial performance index (Mod‐MPI) determined using a novel automated system.