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Igor Kogan

Applied Materials

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Publication

Featured researches published by Igor Kogan.

Archive | 2003

Method and apparatus for heating and cooling substrates

Ratson Morad; Ho Seon Shin; Robin Cheung; Igor Kogan

Archive | 1996

High aspect ratio clamp ring

Joe Stevens; Howard Grunes; Igor Kogan

Archive | 1999

Method and apparatus for both mechanically and electrostatically clamping a wafer to a pedestal within a semiconductor wafer processing system

Igor Kogan

Archive | 1994

Clamp ring for shielding a substrate during film layer deposition

Aihua Chen; Zheng Xu; Howard Grunes; Avi Tepman; Igor Kogan

Archive | 2002

Method for heating and cooling substrates

Ratson Morad; Ho Seon Shin; Robin Cheung; Igor Kogan

Archive | 2000

Method and device for heating and cooling substrate

Robin Cheung; Igor Kogan; Ratson Morad; Ho Seon Shin; コーガン イゴー; セオン シン ホー; モラド ラトソン; チエウン ロビン

Archive | 2002

Method and apparatus for heating and colling substrates

Ratson Morad; Ho Seon Shin; Robin Cheung; Igor Kogan

Archive | 2012

Robot systems, apparatus, and methods adapted to process substrates in multiple tiers

Eric A. Englhardt; Richard Giljum; Jeffrey C. Hudgens; Igor Kogan; Michael R. Rice; Sushant S. Koshti

Archive | 1997

Method and apparatus for both mechanically and electrostatically clamping a wafer

Igor Kogan

Archive | 1997

High aspect ratio clamp

Howard Grunes; Igor Kogan; Joe Stevens

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Collaboration

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Ho Seon Shin

Applied Materials

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Ratson Morad

Applied Materials

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Robin Cheung

Applied Materials

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Howard Grunes

Applied Materials

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Aihua Chen

Applied Materials

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Avi Tepman

Applied Materials

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Eric A. Englhardt

Applied Materials

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Jeffrey C. Hudgens

Applied Materials

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Joe Stevens

Applied Materials

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Michael R. Rice

Applied Materials

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