Ratson Morad
Applied Materials
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Publication
Featured researches published by Ratson Morad.
international interconnect technology conference | 2002
Stan D. Tsai; Liang Chen; Lizhong Sun; R. Mavliev; Wei-Yung Hsu; Li-Qun Xia; Ratson Morad
Copper CMP faces significant technical challenges at the 100 nm technology node and beyond as low-k dielectric materials replace conventional SiO/sub 2/ dielectrics. Low shear force becomes the focus of CMP process development. However, the effects of shear force during the CMP process have not been fully explored. In this paper, we studied the polishing shear force under various process conditions. The correlation between polishing shear force and low-k material delamination is experimentally established. A low shear force CMP process is developed that demonstrates low-k compatibility with comparable polishing performance to conventional high shear operation region.
Archive | 1999
Robin Cheung; Daniel A. Carl; Yezdi Dordi; Peter Hey; Ratson Morad; Liang-Yuh Chen; Paul Smith; Ashok K. Sinha
Archive | 2002
Liang-Yuh Chen; Wei-Yung Hsu; Alain Duboust; Ratson Morad; Daniel A. Carl
Archive | 2003
Ratson Morad; Ho Seon Shin; Robin Cheung; Igor Kogan
Archive | 2002
Ralph M. Wadensweiler; Alain Duboust; Liang-Yuh Chen; Manoocher Birang; Ratson Morad; Paul D. Butterfield
Archive | 2001
Wei-Yung Hsu; Liang-Yuh Chen; Ratson Morad; Daniel A. Carl
Archive | 2002
Stan D. Tsai; Rashid Mavliev; Lizhong Sun; Feng Q. Liu; Liang-Yuh Chen; Ratson Morad
Archive | 2003
B. Chen; Ho Shin; Yezdi Dordi; Ratson Morad; Robin Cheung
Archive | 2001
Robin Cheung; Daniel A. Carl; Liang-Yuh Chen; Yezdi Dordi; Paul Smith; Ratson Morad; Peter Hey; Ashok K. Sinha
Archive | 2004
Stan D. Tsai; Liang-Yuh Chen; Lizhong Sun; Shijian Li; Feng Q. Liu; Rashid Mavliev; Ratson Morad; Daniel A. Carl
