Isabella Rossetto

Buffer Traps in Fe-Doped AlGaN/GaN HEMTs: Investigation of the Physical Properties Based on Pulsed and Transient Measurements

This paper presents an extensive investigation of the properties of the trap with activation energy equal to 0.6 eV, which has been demonstrated to be responsible for current collapse (CC) in AlGaN/GaN HEMTs. The study was carried out on AlGaN/GaN HEMTs with increasing concentration of iron doping in the buffer. Based on pulsed characterization and drain current transient measurements, we demonstrate that for the samples under investigation: 1) increasing concentrations of Fe-doping in the buffer may induce a strong CC, which is related to the existence of a trap level located 0.63 eV below the conduction band energy and 2) this trap is physically located in the buffer layer, and is not related to the iron atoms but-more likely-to an intrinsic defect whose concentration depends on buffer doping. Moreover, we demonstrate that this level can be filled both under OFF-state conditions (by gate-leakage current) and under ON-state operation (when hot electrons can be injected to the buffer): for these reasons, it can significantly affect the switching properties of AlGaN/GaN HEMTs.

Trapping phenomena in AlGaN/GaN HEMTs: a study based on pulsed and transient measurements

Slow trapping phenomenon in AlGaN/GaN HEMTs has been extensively analyzed and described in this paper. Thanks to a detailed investigation, based on a combined pulsed and transient investigation of the current/voltage characteristics (carried out over on an 8-decade time scale), we report a detailed description of the properties of trap levels located in the gate–drain surface, and in the region under the gate of AlGaN/GaN HEMTs. More specifically, the following, relevant results have been identified: (i) the presence of surface trap states may determine a significant current collapse, and reduction of the peak transconductance. During a current transient measurement, the emission of electrons trapped at surface states proceeds through hopping, as demonstrated by means of temperature-dependent measurements. The activation energy of the de-trapping process is equal to 99 meV. (ii) The presence of a high density of defects under the gate may induce a significant shift in the threshold voltage, when devices are submitted to pulsed transconductance measurements. The traps responsible for this process have an activation energy of 0.63 eV, and are detected only on samples with high gate leakage, since gate current allows for a more effective charging/de-charging of the defects.

Negative Bias-Induced Threshold Voltage Instability in GaN-on-Si Power HEMTs

This letter reports an in-depth study of the negative threshold voltage instability in GaN-on-Si metal-insulator-semiconductor high electron mobility transistors with partially recessed AlGaN. Based on a set of stress/recovery experiments carried out at several temperatures, we demonstrate that: 1) operation at high temperatures and negative gate bias (-10 V) may induce a significant negative threshold voltage shift, that is well correlated to a decrease in on-resistance; 2) this process has time constants in the range between 10-100 s, and is accelerated by temperature, with activation energy equal to 0.37 eV; and 3) the shift in threshold voltage is recoverable, with logarithmic kinetics. The negative shift in threshold voltage is ascribed to the depletion of trap states located at the SiN/AlGaN interface and/or in the gate insulator.

Time-Dependent Failure of GaN-on-Si Power HEMTs With p-GaN Gate

This paper reports an experimental demonstration of the time-dependent failure of GaN-on-Si power high-electron-mobility transistors with p-GaN gate, submitted to a forward gate stress. By means of combined dc, optical analysis, and 2-D simulations, we demonstrate the following original results: 1) when submitted to a positive voltage stress (in the range of 7-9 V), the transistors show a time-dependent failure, which leads to a sudden increase in the gate current; 2) the time-to-failure (TTF) is exponentially dependent on the stress voltage and Weibull-distributed; 3) the TTF depends on the initial gate leakage current, i.e., on the initial defectiveness of the devices; 4) during/after stress, the devices show a localized luminescence signal (hot spots); the spectral investigation mainly reveals a peak corresponding to yellow luminescence and a broadband related to bremsstrahlung radiation; and 5) 2-D simulations were carried out to clarify the origin of the degradation process. The results support the hypothesis that the electric field in the AlGaN has a negligible impact on the device failure; on the contrary, the electric field in the SiN and in the p-GaN gate can play an important role in favoring the failure, which is possibly due to a defect generation/percolation process.

Extensive Investigation of Time-Dependent Breakdown of GaN-HEMTs Submitted to OFF-State Stress

This paper reports the experimental demonstration of time-dependent dielectric breakdown in GaN-based high-electron mobility transistors (HEMTs) submitted to OFF-state stress. Based on combined breakdown measurements, constant voltage stress tests, and 2-D simulations, we demonstrate the following relevant results. First, GaN-based HEMTs with a breakdown voltage higher than 1000 V (evaluated by dc measurements) may show time-dependent failure when exposed to OFF-state stress with VDS in the range 600-700 V. Second, time-to-failure (TTF) is Weibull-distributed, and has an exponential dependence on the stress voltage level. Third, time-dependent breakdown is ascribed to the failure of the SiN dielectric at the edge of the gate overhang, on the drain side. Fourth, 2-D simulations confirm that-in this region-the electric field exceeds 6 MV/cm, i.e., the dielectric strength of SiN. Finally, we demonstrate that by limiting the electric field in the nitride through epitaxy and process improvements, it is possible to increase the TTF by three orders of magnitude.

Reliability and parasitic issues in GaN-based power HEMTs: a review

Despite the potential of GaN-based power transistors, these devices still suffer from certain parasitic and reliability issues that limit their static and dynamic performance and the maximum switching frequency. The aim of this paper is to review our most recent results on the parasitic mechanisms that affect the performance of GaN-on-Si HEMTs; more specifically, we describe the following relevant processes: (i) trapping of electrons in the buffer, which is induced by off-state operation; (ii) trapping of hot electrons, which is promoted by semi-on state operation; (iii) trapping of electrons in the gate insulator, which is favored by the exposure to positive gate bias. Moreover, we will describe one of the most critical reliability aspects of Metal-Insulator-Semiconductor HEMTs (MIS-HEMTs), namely time-dependent dielectric breakdown.

Trapping and reliability issues in GaN-based MIS HEMTs with partially recessed gate

Abstract This paper reports an extensive analysis of the trapping and reliability issues in AlGaN/GaN metal insulator semiconductor (MIS) high electron mobility transistors (HEMTs). The study was carried out on three sets of devices with different gate insulators, namely PEALD SiN, RTCVD SiN and ALD Al 2 O 3 . Based on combined dc, pulsed and transient measurements we demonstrate the following: (i) the material/deposition technique used for the gate dielectric can significantly influence the main dc parameters (threshold current, subthreshold slope, gate leakage) and the current collapse; and (ii) current collapse is mainly due to a threshold voltage shift, which is ascribed to the trapping of electrons at the gate insulator and/or at the AlGaN/insulator interface. The threshold voltage shift (induced by a given quiescent bias) is directly correlated to the leakage current injected from the gate; this demonstrates the importance of reducing gate leakage for improving the dynamic performance of the devices. (iii) Frequency-dependent capacitance–voltage (C–V) measurements demonstrate that optimized dielectric allow to lower the threshold-voltage hysteresis, the frequency dependent capacitance dispersion, and the conductive losses under forward-bias. (iv) The material/deposition technique has a significant impact on device robustness against gate positive bias stress. Time to failure is Weibull-distributed with a beta factor not significantly influenced by the properties of the gate insulator. The results presented within this paper provide an up-to-date overview of the main advantages and limitations of GaN-based MIS HEMTs for power applications, on the related characterization techniques and on the possible strategies for improving device performance and reliability.

Impact of gate insulator on the dc and dynamic performance of AlGaN/GaN MIS-HEMTs

Abstract This paper studies the impact of the properties of the SiN gate insulator on the dc and dynamic performance of AlGaN/GaN Metal Insulator Semiconductor High Electron Mobility Transistors (MIS-HEMTs). We compare the dynamic and transient behaviour of devices with identical epitaxial structure and different gate insulators: RTCVD-SiN (rapid-thermal-chemical-vapour-deposition) and PEALD-SiN (plasma-enhanced-atomic-layer-deposition). We demonstrate the following important results: (i) the gate leakage of devices with PEALD-SiN insulator is three orders of magnitude lower than that of samples with RTCVD-SiN; (ii) the use of PEALD-SiN reduces significantly the transistor threshold voltage hysteresis; (iii) both sets of samples show measurable threshold voltage shift when submitted to forward gate bias. In addition we demonstrate (iv) that the V TH shift is well correlated with the gate forward leakage and bias, for both sets of samples. This result indicates that trapping is induced by the injection of electrons in the gate insulator when a positive bias is applied to the gate; in PEALD SiN devices, the reduction of the gate (forward) leakage results in a significant decrease in V TH shift.

Role of buffer doping and pre-existing trap states in the current collapse and degradation of AlGaN/GaN HEMTs

The aim of this work is to quantitatively investigate the influence of buffer doping on the current collapse of AlGaN/GaN HEMTs, and to analyze the contribution of trap states to the increase in current collapse detected after reverse-bias stress. The study was carried out on GaN-based HEMTs with increasing levels of iron doping in the buffer, which were submitted to drain current transient measurements and reverse-bias stress. Results demonstrate that the use of Fe-doping may significantly impact on current collapse; moreover, we demonstrate that the increase in current collapse detected after reverse-bias stress is not due to the generation of new types of defect, but to the increase in the signal of the defects which were already present before stress.

Evidence of Hot-Electron Degradation in GaN-Based MIS-HEMTs Submitted to High Temperature Constant Source Current Stress

This letter demonstrates that GaN-based MIS-HEMTs submitted to stress with high-temperature, high drain bias, and constant source current (HTSC stress) may show degradation modes that are not detectable during standard high temperature reverse bias (HTRB) stress. Based on a number of stress/recovery experiments, we demonstrate the following novel results: 1) the combined presence of high drain bias and constant drain-source current (HTSC stress) can lead to a significant increase in ON-resistance (RON) that is not detected under conventional HTRB stress; 2) RON increases without changes in the threshold voltage, indicating that charge trapping takes place in the access regions, and not under the gate; 3) the RON increase has a monotonic dependence on the source current flowing during stress; and 4) for the same stress current level, the RON increase has a negative dependence on temperature. The strong correlation between RON increase and source current and the negative temperature coefficient strongly support the hypothesis that trapping originates from the injection of hot electrons toward the gate-drain access region.