Akira Kageyama

POLYQUINOLINE/BISMALEIMIDE COMPOSITES AS HIGH-TEMPERATURE-RESISTANT MATERIALS

Polyquinoline/bismaleimide composites containing bismaleimide contents between 5 and 50 wt % have been investigated as high-temperature-resistant materials. The effect of bismaleimide loading on thermal, mechanical, and dielectric properties of polyquinoline has been reported. The dielectric constant of composite thin films was found to vary between 2.90 and 3.10 with the loss tangent ranging between 0.004 and 0.007, depending upon the incorporated bismaleimide content. The thermal, mechanical, and dielectric properties of polyquinoline/bismaleimide composite thin films are discussed.

Study on short failure localization approach by newly developed EBAC technique

Demand of short failure analysis has been increasing in semiconductor failure analysis. It is known from the previous studies that many short failure analysis methods are suggested. However, it is extremely difficult to identify the short failure location in recent advanced devices due to the fact of optical resolution limit. On the other hand EBAC has been noted as the high resolution method to identify an open or a high resistance failure while it is rather difficult for EBAC to identify a short failure. In this study we have developed a new EBAC amplifier and evaluated a short failure case for identifying the location clearer enough than conventional analysis methods. This paper describes successful use of the new EBAC amplifier which has sufficient enough resolution of EBAC signal to identify the failure locations for next step physical analyses of FIB, STEM or so on.

The development of electron beam absorbed current imaging system using scanning transmission electron microscope and its application

To realize higher spatial resolution than conventional SEM-based nano-probing system, a novel Electron Beam Absorbed Current imaging system was newly developed using a Hitachi HD-2700 200 kV dedicated STEM. Its specimen holder accommodates a mechanical probe for current detection and TEM grid specimen. This holder also has a micrometer-based coarse positioning and piezoelectric-elements-based fine positioning mechanism respectively for X, Y and Z-axis probe control. The absorbed current from the probe and the specimen are displayed as an image by STEM software via EBAC amplifier. We successfully made a probing onto FIB-prepared lamella specimen of semiconductor device to get an electrical contact. EBAC and EBIC images were clearly visualized in higher spatial resolution.