Aizou Kaneda | Researchain

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Archive | 1989

Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

Noriyuki Kinjo; Masatsugu Ogata; Kunihiko Nishi; Aizou Kaneda; K. Dušek

Archive | 1996

Method of production of semiconductor device

Aizou Kaneda; Masaaki Yasuda; Itsuo Watanabe; Tomohisa Ohta; Fumio Inoue; Yoshiaki Tsubomatsu; Toshio Yamazaki; Hiroto Ohata; Kenzo Takemura; Akira Nagai; Osamu Watanabe; Naoyuki Shiozawa; Kazuyoshi Kojima; Toshiaki Tanaka; Kazunori Yamamoto

Archive | 1997

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 1997

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Kazunori Yamamoto; Yasushi Shimada; Yasushi Kumashiro; Teiichi Inada; Hiroyuki Kuriya; Aizou Kaneda; Takeo Tomiyama; Yoshihiro Nomura; Yoichi Hosokawa; Hiroshi Kirihara; Akira Kageyama

Archive | 1995

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Akio Kotato; Yuusuke Miyamae; Tadaji Satou; Makoto Saitou; Tooru Kikuchi; Akira Kageyama; Shinji Takeda; Takashi Masuko; Masami Yusa; Yasuo Miyadera; Mituo Yamasaki; Iwao Maekawa; Aizou Kaneda

Archive | 2001

Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof

Yasuhiro Yano; Hidekazu Matsuura; Yoshihiro Nomura; Yoshii Morishita; Touichi Sakata; Hiroshi Nishizawa; Toshiaki Tanaka; Masaaki Yasuda; Aizou Kaneda

Archive | 1996

Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device

Aizou Kaneda; Masaaki Yasuda; Itsuo Watanabe; Tomohisa Ohta; Fumio Inoue; Yoshiaki Tsubomatsu; Toshio Yamazaki; Hirohito Ohata; Kenzo Takemura; Akira Nagai; Osamu Watanabe; Naoyuki Shiozawa; Kazuyoshi Kojima; Toshiaki Tanaka; Kazunori Yamamoto

Archive | 1999

Paste composition, and protective film and semiconductor device both obtained with the same

Toshiaki Tanaka; Takafumi Ichihara-shi Dohdoh; Tsutomu Kitakatsu; Aizou Kaneda; Masaaki Yasuda; Takashi Tsukuba-shi Kousaka; Akira Kageyama

Archive | 2001

Semiconductor device and process for fabrication thereof

Shinji Takeda; Takashi Masuko; Masami Yusa; Tooru Kikuchi; Yasuo Miyadera; Iwao Maekawa; Mitsuo Yamasaki; Akira Kageyama; Aizou Kaneda

Archive | 2006

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

Yasuhiro Yano; Hidekazu Matsuura; Yoshihiro Nomura; Yoshii Morishita; Touichi Sakata; Hiroshi Nishizawa; Toshiaki Tanaka; Masaaki Yasuda; Aizou Kaneda

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