J. Van Kerrebrouck

Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.

This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8 prisms are defined on top of the GCs using non-uniform laser ablation process. The prisms enable perfectly vertical coupling from the bonded VCSELs to the GCs. The VCSELs are flip-chip bonded on top of the silicon GCs employing the laser-induced forward transfer (LIFT)-assisted thermocompression technique. An excess loss of < 1 dB at 1.55 µm measured from the bonded assemblies is reported in this paper. The results of high speed transmission experiments performed on the bonded assemblies with clear eye openings up to 20 Gb/s are also presented.

Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of <; 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved.

Towards efficient 100 Gb/s serial rate optical interconnects: A duobinary way

Recent advances in integrated opto-electronic devices and front end circuits have made it possible to efficiently transmit very high data rates over optical links for HPC/datacenter applications. This paper reviews our current progress towards serial 100-Gb/s optical interconnects, with emphasis on electrical duobinary (EDB) modulation.