James D. Meindl

Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof

Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof

3-D ICs with microfluidic interconnects and methods of constructing same

Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication

Monolithically-fabricated Compliant Wafer-level Package With Wafer Level Reliability And Functionality Testability

Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof

Compliant wafer-level packaging devices and methods of fabrication

OPTICAL INTERCONNECT DEVICES AND STRUCTURES BASED ON METAMATERIALS

Phase mask consisting of an array of multiple diffractive elements for simultaneous accurate fabrication of large arrays of optical couplers and method for making same

Low cost high density Compliant Wafer Level Package