Jean-Luc Muraro
Alenia Aeronautica
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Publication
Featured researches published by Jean-Luc Muraro.
international microwave symposium | 2005
S. Melle; David De Conto; David Dubuc; Katia Grenier; Olivier Vendier; Jean-Luc Muraro; Jean-Louis Cazaux; Robert Plana
The kinetic of dielectric charging in capacitive RF microelectromechanical systems (RF MEMS) is investigated using an original method of stress and monitoring. This effect is investigated through a new parameter: the shift rate of the actuation voltages. We demonstrate that this lifetime parameter has to be considered as a function of the applied voltage normalized by the contact quality between the bridge and the dielectric. We also demonstrate that this phenomenon is related to Frenkel-Poole conduction, which takes place into the dielectric. We finally propose a model that describes the dielectric charging kinetic in capacitive RF MEMS. This model is used to extract a figure-of-merit of capacitive switches lifetime.
international conference on micro electro mechanical systems | 2004
S. Melle; F. Flourens; David Dubuc; Katia Grenier; Patrick Pons; Jean-Luc Muraro; Y. Segui; Robert Plana
This paper reports on the investigation of stiction and screening effects, which principally limit the lifetime of capacitive RF MEMS. These phenomena are the consequence of the dielectric charging which occurs during the running of the switch. To understand this effect, we have developed a specific test set which measures the microwave and electromechanic performances to evaluate the reliability of RF MEMS. Several experiments have thus been performed such as DC bias stress and cycling. These tests have shown that the dielectric charging creates a drift of the threshold voltages and that the difference between the pull-down and the pull-up voltages is an important parameter which drives the type of failure: stiction or screening.
International Journal of Microwave and Wireless Technologies | 2010
Jean-Luc Muraro; Guillaume Nicolas; Do Minh Nhut; Stéphane Forestier; Stéphane Rochette; Olivier Vendier; Dominique Langrez; Jean-Louis Cazaux; Marziale Feudale
On the last years, gallium nitride (GaN) technology has made a remarked breakthrough in the world of microwave electronics. Power transistors are now available. How this GaN technology would impact space-borne units is now a priority concern. Although the power capability of GaN technology is the first obvious profit, GaN could also be used for other applications like low noise amplifiers, mixers, and probably more. The high sustainable temperature of GaN transistors is most striking advantage for in-flight use. This is connected to packaging design which is also experiencing a lot of activities and quick progresses. Of course, space application is dependent upon the full demonstration of reliability and this constitutes another field of investigation. Finally, after 8 years of GaN studies, experimental results are presented: they open wide the road a revolution inside space-borne electronics: the rise of GaN.
international microwave symposium | 2015
O. Lazar; J.G. Tartarin; Benoit Lambert; C. Moreau; J.L. Roux; Jean-Luc Muraro
This paper proposes a diagnostic tool dedicated to the analysis of the Schottky Barrier Height (SBH). The proposed method is mainly relevant for studying gate related failure mechanisms in electronic devices. In this case, the SBH of gallium nitride High Electron Mobility Transistors (HEMTs) is investigated in terms of mean SBHs value and dispersion. It is shown that according to given temperature and gate current ranges, linear relationships can be extracted between the mean SBH and the inhomogeneities that appear in forward-biased diode. These behaviors are able to highlight different kind of defects, revealing possible weaknesses of the devices.
international microwave symposium | 2015
Agostino Benvegnù; Sylvain Laurent; Matteo Meneghini; Gaudenzio Meneghesso; Jean-Luc Muraro; Denis Barataud; Enrico Zanoni; Raymond Quéré
An advanced microwave characterization technique has been developed to determine the trapping and detrapping time constants due to wide Pulsed-RF large-signal excitation of AlGaN/GaN High-Electron Mobility Transistors (HEMTs). This approach is based on combined Continuous Waveform (CW) Time-Domain Load-Pull measurements and low frequency (LF) drain current transient measurements under one wide non-periodic Pulsed-RF excitation to investigate trapping phenomena. The trap capture and emission time constants are extracted by applying the current-transient method for different RF large-signal input power levels and for varying duration of pulse-width (PW) of the one pulse-RF excitation. The strong influence of the RF load-line excursion in the Drain current collapse after the RF stimulus is also demonstrated.
radiation effects data workshop | 2013
R. Marec; Alain Bensoussan; Jean-Luc Muraro; L. Portal; P. Calvel; C. Barillot; M. G. Perichaud; L. Marchand; G. Vignon
Specific Single Event Effects characterization based on RF and worst case DC conditions are used to demonstrate that two European GaAs power P-HEMT MMIC processes are safe under heavy ions.
IEEE Transactions on Electron Devices | 2017
Agostino Benvegnu; Sylvain Laurent; Olivier Jardel; Jean-Luc Muraro; Matteo Meneghini; Denis Barataud; Gaudenzio Meneghesso; Enrico Zanoni; Raymond Quéré
This paper presents a new nonlinear microwave-based characterization methodology for the study of the deep levels proprieties in gallium nitride (GaN)-based high electron mobility transistors (HEMTs). Currently, it is unique measurement method allowing the extraction of time constants of HEMTs operating under large signal RF conditions. This method improves the conventional dc techniques, since it employs RF excitation during the filling condition to investigate the impact of “real-life” RF excitation on the trapping mechanisms. The experimental results demonstrate that, beyond the presence of Poole–Frenkel effect, the slow detrapping time constant is accelerated by the power dissipation of the trapping bias point. Moreover, it is possible to distinguish the impact of dc and RF conditions on the trapping phenomena. The temperature measurements allow identifying the 0.75-eV deep level, attributed to extended defects in GaN, when ionized under dc excitation. This deep level trap is probably located in the buffer layer and contributes to the RF trapping phenomenon.
IEEE Transactions on Device and Materials Reliability | 2006
Nathalie Malbert; Nathalie Labat; Naoufel Ismail; Andre Touboul; Jean-Luc Muraro; Francis Brasseau; Dominique Langrez
This paper provides a new approach to evaluate the transistor safe operating area for a nonlinear operation in the overdrive operating conditions. This approach has been implemented for a MESFET technology. The methodology consists in performing ON-state and OFF-state accelerated DC step stresses for bias conditions, which can be reached by VDS and VGS sweeps in the overdrive operating conditions. Hence, the results of an RF ageing test performed in nonlinear conditions have confirmed the methodology used in this paper
european microwave integrated circuits conference | 2015
Agostino Benvegnù; Davide Bisi; Sylvain Laurent; Matteo Meneghini; Gaudenzio Meneghesso; Jean-Luc Muraro; Denis Barataud; Enrico Zanoni; Raymond Quéré
european microwave conference | 2013
Davide Resca; Francesco Scappaviva; Corrado Florian; Stéphane Rochette; Jean-Luc Muraro; Valeria di Giacomo Brunel; Christophe Chang; Didier Baglieri