Jean-Pierre Laur

Integrated LC Filter on Silicon for DC–DC Converter Applications

The integration of passive components on silicon for future dc-dc converter applications is still a challenging area of research. This paper reports the microfabrication of a fully integrated filter containing a spiral inductor on top of a 3-D capacitor. A thin magnetic shielding layer is introduced between the two components demonstrating that losses caused by the inductor in the capacitor area are reduced, thus increasing the maximum working frequency of the whole component. The fabricated filter was characterized in a test circuit (buck-type converter).

A new circuit-breaker integrated device for protection applications

In this paper, a new circuit-breaker integrated device for low power electronic circuit protection, based on the functional integration mode, is investigated. The influence of the physical and technological parameters of this device upon the main electrical characteristics has been analyzed using analytical models and the ATLAS software tool. The initial experimental results are presented.

New Self-Switching Converters

This paper presents an original concept in which integrated over-voltage and/or over-current protections of power devices are used to produce a self-switching operation. Such a commutation is shown as a possible combination with conventional forced-switching and spontaneous-switching to simplify direct regenerative ac-dc conversion, insulating dc-ac-dc conversion and finally direct ac-ac conversion. Experimental results prove the feasibility of the concept through which the self turn-off operation is likely to offer the best practical gains.

The concave junction: an attractive topology to design specific junction terminations

In this paper a new junction topology, the concave junction, and its application in specific junction terminations are presented. We demonstrate, by solving the ionization integrals in the non-punchthrough case, that the breakdown voltage of this type of junction can be higher than that of the infinite plane junction. Based on numerical simulations, we investigate the use of this property to design peripheral terminations for vertical devices with very deep trenches.

Low-profile small-size ferrite cores for powerSiP integrated inductors

Ferrite-based micro-inductors integrated on silicon are proposed as potential hybrid integration in low-power medium frequency DC-DC power converters. The inductors are fabricated at wafer level using micromachining and flip chip assembling techniques. The proposed process is based on a sintered ferrite core placed in between thick electroplated copper windings on two silicon substrates. The low profile (110 μm thick) ferrite cores are produced by thermal bonding of two green tape-casted films of 1.2 × 2.6 × 0.2 mm3, then micro-milled to the final dimensions before sintering. This paper presents the magnetic characterization of the sintered ferrite films cut in rectangular shape and sintered at different temperatures. It is concluded that these small dimension cores could be used in the frequency range applications of 5-10 MHz and would potentially allow a high inductance density in a 3D integration process.

Design of an Integrated Self-Switching Mode Device for Power Converters

In this paper, we present a design procedure for the integration of a new specific function based on the association of a ZVS mode thyristor and a circuit breaker dedicated to self-switching mode power converters. This function, based on the functional integration concept, monolithically associates protection, self-drive and power switch functions. This function uses an original switching mode of operation. After presenting the characteristics of the function and the function specifications, we focus on the different design steps: function optimization and cells sizing using 2D electrical and technological simulations, and mask design.

Micro inductors using low temperature fabrication processes for integrated DC-DC microconverters

We present in this paper trends and technologies for the integration of inductors for DC-DC microconverters. In particular, we present the fabrication steps of different structures as a function of the application: planar inductors for low power consumption, and 3D magnetic inductors for higher power. These devices are achieved using low temperature fabrication processes based in photolithography or and electroplating techniques.

A new self-firing MOS-thyristor device: optimization of the turn-off performance and experimental results

In this paper, a new integrated self-firing and controlled turn-off MOS-thyristor structure is investigated. An analytical model describing the turn-off operation and parasitic latch-up was developed, allowing to highlight and optimize the physical and geometrical parameters acting upon main electrical characteristics. The analytical model is validated by two-dimensional (2D) simulations using PISCES. The technological fabrication process is optimized by 2D simulations using SUPREM IV. Electrical characterization results of fabricated test structures are presented.

Architectures d'interrupteur de puissance autocommuté

In this paper, a detailed analysis of a new monolithically integrated power device dedicated for self switching converters is carried out. We proposed two original solutions based on two power switches: a MOS-thyristor and an IGBT-sense. Their operation mode is analyzed using 2D physical simulation. Then, the obtained results are discussed to compare the two topologies.