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Dive into the research topics where Jeffrey C. Maling is active.

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Featured researches published by Jeffrey C. Maling.


international conference on solid-state sensors, actuators and microsystems | 2011

Planar MEMS RF capacitor integration

Anthony K. Stamper; C. V. Jahnes; S. R. Dupuis; A. Gupta; Zhong-Xiang He; R. T. Herrin; S. E. Luce; Jeffrey C. Maling; D. R. Miga; W. J. Murphy; Eric J. White; S. J. Cunningham; D. R. DeReus; I. Vitomirov; A. S. Morris

MEMS capacitor switches have been integrated with high voltage CMOS ICs. The MEMS were formed with the final three AlCu wiring levels in SiO2 using a planar sacrificial silicon cavity process. The MEMS cavities were hermetically sealed at less than atmospheric pressure at wafer level. After Pb-free solder bumping, the MEMS chips are packaged in organic laminate packages. The capacitor portion of the MEMS beam has a capacitance density of ∼0.12fF/µm2 and the pull-in, restoring, self-actuation, and break down voltages are on the order of 25V, 10V, >45V, and >150V respectively. MEMS cycling lifetime over 250 Mcycles with no fails has been demonstrated. This paper summarizes the critical integration, yield, and reliability issues associated with developing this rf MEMS technology.


optical fiber communication conference | 2015

An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides

Tymon Barwicz; Alexander Janta-Polczynski; Marwan H. Khater; Yan Thibodeau; Robert K. Leidy; Jeffrey C. Maling; Stephan L. Martel; Sebastian U. Engelmann; Jason S. Orcutt; Paul Fortier; William M. J. Green


Archive | 2012

SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIGN STRUCTURES

Jeffrey C. Maling; Anthony K. Stamper; Dana R. DeReus; Arthur S. Morris


Archive | 2006

Deep trench formation in semiconductor device fabrication

June Cline; Dinh Dang; Mark Lagerquist; Jeffrey C. Maling; Lisa Y. Ninomiya; Bruce W. Porth; Steven M. Shank; Jessica A. Trapasso


Archive | 2004

Masked sidewall implant for image sensor

James W. Adkisson; Mark D. Jaffe; Arthur Johnson; Robert K. Leidy; Jeffrey C. Maling


Archive | 2010

Methods of manufacture for micro-electro-mechanical system (MEMS)

Russell T. Herrin; Jeffrey C. Maling; Anthony K. Stamper


Archive | 2009

DEEP TRENCH IN A SEMICONDUCTOR STRUCTURE

June Cline; Dinh Dang; Mark Lagerquist; Jeffrey C. Maling; Lisa Y. Ninomiya; Bruce W. Porth; Steven M. Shank; Jessica A. Trapasso


Archive | 2017

Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides

Jeffrey P. Gambino; Robert K. Leidy; John J. Ellis-Monaghan; Brett Cucci; Jeffrey C. Maling; Jessie C. Rosenberg


Archive | 2014

WAFER FRONTSIDE-BACKSIDE THROUGH SILICON VIA

Jeffrey C. Maling; Anthony K. Stamper; Zeljka Topic-Beganovic; Daniel S. Vanslette


Archive | 2013

Automated residual material detection

Jeffrey C. Maling; Anthony K. Stamper; Zeljka Topic-Beganovic

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