Jeffrey T. Rahn

Current Status of Large-Scale InP Photonic Integrated Circuits

In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.

Multi-channel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC) operating at 112 Gb/s per wavelength

A 10-wavelength, polarization-multiplexed, monolithically integrated InP transmitter PIC is demonstrated for the first time to operate at 112 Gb/s per wavelength with a coherent receiver PIC.

10 Channel, 45.6 Gb/s per Channel, Polarization-Multiplexed DQPSK, InP Receiver Photonic Integrated Circuit

We demonstrate a 10 wavelength, 200 GHz spaced, monolithically integrated, polarization-multiplexed, InP differential quadrature phase shift keying receiver operating at 45.6 Gb/s per wavelength. The receiver is based on a novel technique for polarization demodulation and phase tracking that does not require any external components.

Terabit/s class InP photonic integrated circuits

In this paper, we review recent developments in the area of terabit/s?class monolithically integrated, transmitter and receiver photonic integrated circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

250Gb/s real-time PIC-based super-channel transmission over a gridless 6000km terrestrial link

A 250Gb/s super-channel using Photonic Integrated Circuits (PIC) was transmitted over 6000km along with a 500Gb/s super-channel and conventional 40Gb/s and 100Gb/s channels. The linear terrestrial line system uses FlexWSS multiplexing technologies and Hybrid RamanEDFA amplifiers.

1.12 Tb/s superchannel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC)

In this work, a 10-wavelength, polarization-multiplexed, monolithically integrated InP coherent QPSK transmitter PIC is demonstrated to operate at 112 Gb/sec per wavelength and total chip superchannel bandwidth of 1.12 Tb/s. This demonstration suggests that increasing data capacity to multi-Tb/s per chip is possible and likely in the future.

500 Gb/s and beyond photonic integrated circuit module transmitters and receivers

500-Gb/s transmitter and receiver photonic integrated circuit (PIC) modules are reviewed as well as their scaling to Tb/s and higher data capacities.

Real-Time PMD Tolerance Measurements of a PIC-Based 500 Gb/s Coherent Optical Modem

We present real-time polarization mode dispersion (PMD) tolerance measurement results with a commercially available 500 Gb/s coherent modem. The first- and second-order PMD space is explored, showing that peak values of 500 ps of static, first-order PMD (differential group delay) have small penalties. The system was stressed using fast scrambling, with polarization change of over 10 000 rad/s, along with high mean PMD. Penalties were small with sufficient equalization.

Extended C-Band Tunable Multi-Channel InP-Based Coherent Transmitter PICs

We demonstrate a fully integrated multi-channel InP-based coherent transmitter photonic integrated circuits (PICs) with extended C-band tunability, operating at 33 and 44 Gbaud per channel under 16-QAM dual-polarization modulation. PICs are demonstrated integrating up to 14-channels enabling multi-Tb/s total PIC capacities.

Photonic integrated circuits for phase modulation formats

We will review the latest performance metrics for components enabling communication networks based on phase modulation formats. For spectral efficiency, reduced complexity, reliability, and power consumption; monolithic integration on InP is clearly the superior path.