Jeonghee Shin

A Framework for Architecture-Level Lifetime Reliability Modeling

This paper tackles the issue of modeling chip lifetime reliability at the architecture level. We propose a new and robust structure-aware lifetime reliability model at the architecture-level, where devices only vulnerable to failure mechanisms and the effective stress condition of these devices are taken into account for the failure rate of microarchitecture structures. In addition, we present this reliability analysis framework based on a new concept, called the FIT of reference circuit or FORC, which allows architects to quantify failure rates without having to delve into low-level circuit- and technology-specific details of the implemented architecture. This is done through a onetime characterization of a reference circuit needed to quantify the reference FITs for each class of modeled failure mechanisms for a given technology and implementation style. With this new reliability modeling framework, architects are empowered to proceed with architecture-level reliability analysis independent of technological and environmental parameters.

Error Tolerance in Server Class Processors

This paper provides: 1) a very brief motivation and technological trend data to show why hard and soft errors are expected to be of increasing concern in the future; 2) a summary review of chip-level error tolerance practices today-with a brief reference to IBMs POWER6 and POWER7 designs; 3) open research challenges and current solution approaches of promise, based on published literature; and 4) concluding remarks.

Power management of multi-core chips: challenges and pitfalls

Modern processor systems are equipped with on-chip or on-board power controllers. In this paper, we examine the challenges and pitfalls in architecting such dynamic power management control systems. A key question that we pose is: How to ensure that such managed systems are “energy-secure” and how to pursue pre-silicon modeling to ensure such security? In other words, we address the robustness and security issues of such systems. We discuss new advances in energy-secure power management, starting with an assessment of potential vulnerabilities in systems that do not address such issues up front.

Early chip planning cockpit

The design of high-performance servers has always been a challenging art. Now, server designers are being asked to explore a much larger design space as they consider multicore heterogeneous architecture and the limits of advancing silicon technology. Bringing automation to the early stages of design can enable more rapid and accurate trade-off analysis. In this paper, we introduce an Early Chip Planner which allows designers to rapidly analyze microarchitecture, physical and package design trade-offs for 2D and 3D VLSI chips and generates an attributed netlist to be carried on to the implementation stage. We also describe its use in planning a 3D special-purpose server processor.

Floorplanning challenges in early chip planning

Early chip planning is becoming more critical as server system designers strive to explore a large design space with multiple cores and accelerators in an advanced silicon technology that includes 3D chip stacking. During early chip planning, designers search for the high-level design and layout that best satisfies a myriad of constraints and targets. In this paper, we discuss our experience in applying traditional floorplanning tools at this early stage and suggest how they might be adapted for early floorplanning.