Jeremy T. Anderson

Aqueous Inorganic Inks for Low-Temperature Fabrication of ZnO TFTs

A simple, low-cost, and nontoxic aqueous ink chemistry is described for digital printing of ZnO films. Selective design through controlled precipitation, purification, and dissolution affords an aqueous Zn(OH)(x)(NH(3))(y)((2-x)+) solution that is stable in storage, yet promptly decomposes at temperatures below 150 degrees C to form wurtzite ZnO. Dense, high-quality, polycrystalline ZnO films are deposited by ink-jet printing and spin-coating, and film structure is elucidated via X-ray diffraction and electron microscopy. Semiconductor film functionality and quality are examined through integration in bottom-gate thin-film transistors. Enhancement-mode TFTs with ink-jet printed ZnO channels annealed at 300 degrees C are found to exhibit strong field effect and excellent current saturation in tandem with incremental mobilities from 4-6 cm(2) V(-1) s(-1). Spin-coated ZnO semiconductors processed at 150 degrees C are integrated with solution-deposited aluminum oxide phosphate dielectrics in functional transistors, demonstrating both high performance, i.e., mobilities up to 1.8 cm(2) V(-1) s(-1), and the potential for low-temperature solution processing of all-oxide electronics.

Spin-coated zinc oxide transparent transistors

A ZnO transparent thin-film transistor (TTFT) with a channel layer formed via spin-coating deposition is demonstrated. The TTFT is highly transparent and exhibits n-channel, enhancement-mode behaviour with a channel mobility as large as 0.20 cm2 V−1 s−1 and a drain current on-to-off ratio of nearly 107.

Integrated fab process for metal oxide EUV photoresist

Inpria is developing directly patternable, metal oxide hardmasks as robust, high-resolution photoresists for EUV lithography. Targeted formulations have achieved 13nm half-pitch at 35 mJ/cm2 on an ASML’s NXE:3300B scanner. Inpria’s second-generation materials have an absorbance of 20/μm, thereby enabling an equivalent photon shot noise compared to conventional resists at a dose lower by a factor of 4X. These photoresists have ~40:1 etch selectivity into a typical carbon underlayer, so ultrathin 20nm films are possible, mitigating pattern collapse. In addition to lithographic performance, we review progress in parallel advances required to enable the transition from lab to fab for such a metal oxide photoresist. This includes considerations and data related to: solvent compatibility, metals cross-contamination, coat uniformity, stability, outgassing, and rework.

Transparent electronics and prospects for transparent displays

Transparent electronics is a nascent technology whose objective is the realization of invisible electronic circuits. Part of the impetus for the development of transparent electronics is the recent availability of p-type transparent conductive oxides (TCOs). With the emergence of p-type TCOs, in addition to conventional n-type TCOs such as indium-tin oxide, tin oxide, and zinc oxide, fabrication of transparent bipolar electronic devices becomes feasible. The first part of this paper reviews TCOs and discusses our work in the development of p-TCOs and alternative TC materials (e.g. sulfides). We have recently invented a novel, n-channel, accumulation-mode transparent thin-film transistor (TTFT). This TTFT is highly transparent, has very little light sensitivity, and exhibits electrical characteristics that appear to be suitable for implementation as a transparent select-transistor in each pixel of an active-matrix liquid-crystal display (AMLCD). Moreover, the processing technology used to fabricate this device is relatively simple and appears to be compatible with inexpensive glass substrate technology. The second part of this paper focuses on TTFTs. If transparent electronics is employed to realize transparent back-plane electronic drivers on transparent substrates, fabrication of a transparent display becomes feasible. The third part of this paper offers an approach for realization of a transparent display.

Metal oxide EUV photoresist performance for N7 relevant patterns and processes

Inpria continues to leverage novel metal oxide materials to produce high resolution photoresists for EUV lithography with high optical density and etch resistance. Our resists have previously demonstrated 13nm line/space patterns at 35 mJ/cm2, with extendibility to 10nm half-pitch.1 We have continued to improve photospeed and in this work we provide an update on imaging performance. Since practical patterns for EUV layers will be more complicated than line/space patterns, we also expand on our previous work by demonstrating 2D resist performance using N7 (7nm node) contact and block mask patterns on full field scanners. A resist model has been created and using this model comparisons are made between a metal oxide resist and CAR platforms. Based on this physical model, the impact of shot noise is examined in relation to realistic 2D features. Preliminary data on the effect on OPC of using a non-chemically amplified resist are also presented.

17.4L: LateNews Paper: Contact Resistance and Process Integration Effects on HighPerformance Oxide TFTs with SolutionDeposited Semiconductor and Gate Dielectric Layers

Highperformance TFTs with solutiondeposited amorphous oxide semiconductor and gate dielectric layers are fabricated at ≤ 350 °C. The initial performance and stability of these TFTs are investigated with respect to device structure and source/drain materials. Topcontact TFTs exhibit better electrical performance and reliability than bottomcontact devices. Representative topcontact device mobility is 1.90 cm2/Vs with an ontooff drain current ratio of 7.0 × 108.