Jih-Churng Twu

Lightly nitridation surface for preparing thin-gate oxides

Method to prevent copper CMP dishing

Reduction of surface defects on amorphous silicon grown by a low-temperature, high pressure LPCVD process

Method for forming a self-aligned copper structure with improved planarity

Multilayer interface in copper CMP for low K dielectric

Method for cleaning semiconductor wafers with ozone-containing solvent

Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer

Amorphous silicon gate with mismatched grain-boundary microstructure

Elimination of electrochemical deposition copper line damage for damascene processing

Method to remove residue in wolfram CMP